Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
KOA RK73H2ATTD1201F
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- KOA RK73H2ATTD1201F
- Type
- KOA
- Unit
- Electronic Component
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- KOA
- Electronic Component
- RK73H2ATTD1201F
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.027g
- Electronic Component
- 1.2kΩ
- Electronic Component
- 1
- Electronic Component
- BM0265802644
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±100ppm/℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RK73H2ATTD1201F 产品概述
一、产品定位与核心身份
RK73H2ATTD1201F是日本KOA品牌推出的0805封装厚膜贴片电阻，属于通用型高精度功率电阻范畴。该型号以1.2kΩ（1201阻值代码）为核心参数，结合±1%精度、250mW额定功率及宽温范围，适配工业级、消费电子等多领域的中低功率电路需求，是PCB高密度布局场景的常规选型之一。
二、关键性能参数详解
（一）阻值与精度
标称阻值为1.2kΩ（代码“1201”，即120×10¹Ω），精度等级为**±1%**——此精度可避免±5%精度电阻的误差累积问题，适配运算放大器反馈网络、电压分压电路等对阻值稳定性要求较高的场景。
（二）功率与电压能力
- 额定功率：250mW（0.25W），支持中等功率负载，如小型电源限流电阻、音频放大电路负载；
- 工作电压：150V（直流/交流），满足24V、48V工业电源的分压/采样需求，无需额外降额即可稳定工作。
（三）温度特性与工作范围
- 温度系数（TCR）：±100ppm/℃，温度每变化1℃，阻值漂移约0.01%。以**-55℃~+155℃宽温范围**计算，最大阻值变化量为25.2Ω（相对变化约2.1%），叠加±1%精度后仍能满足工业级温度波动需求；
- 工作温度：覆盖-55℃至+155℃，远超消费级电阻（0℃~70℃），可用于户外设备、高温机械等场景。
三、封装与工艺特性
（一）封装规格
采用0805封装（公制2012，尺寸2.0mm×1.2mm），体积小巧适配高密度PCB（如手机主板、小型通信模块），焊接可靠性符合IPC标准。
（二）厚膜工艺优势
- 膜层厚度10~100μm，抗冲击振动能力优于薄膜电阻；
- 陶瓷基底结合牢固，长期使用无阻值漂移加速问题，可靠性达工业级标准；
- 成本低于薄膜电阻，性能优于碳膜贴片电阻，兼顾性价比与稳定性。
四、典型应用场景
- 工业控制：PLC输入输出模块、传感器信号调理（如温度传感器分压校准）；
- 消费电子：小型电源适配器限流电阻、音频解码板反馈电阻、LED驱动限流元件；
- 通信设备：小型基站模块、路由器主板信号分压/限流电路；
- 汽车电子：车载小功率传感器电路（如胎压监测信号调理，需宽温支持）。
五、品牌与可靠性保障
KOA作为日本老牌厂商，电阻研发制造经验超60年，产品符合：
- 环保认证：RoHS、REACH无铅兼容；
- 一致性：批量生产阻值偏差、温漂离散性小，适配大规模量产；
- 可靠性：通过高温老化、振动测试，满足5年以上设备寿命要求。
该型号以“性能稳定+成本可控”为核心优势，是中低功率电路设计的高性价比选型。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
