Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
KOA RK73H2BTTD7501F
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- KOA RK73H2BTTD7501F
- Type
- KOA
- Unit
- Electronic Component
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- KOA
- Electronic Component
- RK73H2BTTD7501F
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 7.5kΩ
- Electronic Component
- 1
- Electronic Component
- BM0257408140
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RK73H2BTTD7501F 厚膜贴片电阻产品概述
一、产品核心定位与适用场景
RK73H2BTTD7501F是KOA品牌针对工业控制、汽车电子、消费电子等领域推出的1206封装厚膜贴片电阻，主打“成本可控+宽温稳定+小功率适配”特性，可覆盖信号分压、偏置电路、滤波网络等常规电路需求，同时满足极端温度下的长期可靠性要求，是中低功耗场景下的高性价比选择。
二、关键性能参数深度解析
1. 阻值与精度
标称阻值7.5kΩ，精度±1%——该精度等级无需额外校准即可满足大多数模拟电路的功能需求（如传感器前端信号调理、微控制器外围偏置），避免因阻值误差导致的电路参数偏移，兼顾性能与成本。
2. 功率与功耗
额定功率250mW——属于小功率贴片电阻范畴，适配低功耗电路（如便携式设备、无线模块），无需担心功率过载引发的器件失效，同时降低电路散热设计复杂度。
3. 温度系数（TCR）
±100ppm/℃——以7.5kΩ为例，温度每变化1℃，阻值漂移仅0.00075kΩ（0.75Ω）；即使在100℃温差下，漂移也仅0.75kΩ（约0.1%），远低于电路允许的误差范围，保证宽温环境下的性能一致性。
4. 工作温度范围
-55℃+155℃——覆盖**工业级（-4085℃）、汽车级（-40~125℃）** 及部分极端场景（如高温车间、户外设备），可在长期温度波动中稳定工作，无需额外温度补偿电路。
三、封装与可靠性设计
采用1206英制封装（公制3.2×1.6mm），尺寸紧凑适配高密度PCB设计，同时预留足够散热面积支撑250mW功率。厚膜工艺结合陶瓷基板，兼具：
- 成本优势：比薄膜电阻降低约30%成本，适合批量应用；
- 稳定性：抗机械振动、湿度老化能力优于碳膜电阻，满足工业/汽车场景的振动测试要求；
- 一致性：每批次产品经过阻值筛选与温度特性测试，确保批量生产中的性能统一。
四、品牌与品质保障
KOA作为日本老牌电子元器件厂商，拥有60+年厚膜电阻研发经验，其产品广泛应用于丰田、西门子等终端厂商的核心电路。RK73H2BTTD7501F遵循KOA严格品控流程：
- 原材料选用高纯度陶瓷基板与厚膜浆料；
- 生产过程中100%阻值检测，TCR抽样比例≥5%；
- 可靠性测试覆盖温度循环（-55~155℃，1000次）、湿度老化（85℃/85%RH，1000h），满足JIS C 5201-1标准。
五、典型应用场景
- 工业自动化：PLC输入模块的信号分压电路，适配车间四季温度变化；
- 汽车电子：车身控制器的传感器偏置电路，满足汽车级振动与温度要求；
- 消费电子：智能家居无线模块的滤波网络，小功率特性适配低功耗设计；
- 医疗设备：便携式监护仪的信号调理电路，精度与稳定性保证医疗数据准确性。
该产品通过平衡性能、成本与可靠性，成为多领域中低功耗电路的首选贴片电阻之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
