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RK73H2BTTD1003F是KOA公司推出的一款1206封装厚膜贴片电阻,针对中小功率、中高压、中等精度的电子电路需求设计,具备宽温度范围、高稳定性等核心优势,广泛应用于工业控制、通信、消费电子等领域。
该电阻的关键参数均围绕工业级应用需求优化,具体如下:
参数类别 具体规格 关键备注 电阻类型 厚膜贴片电阻 陶瓷基厚膜印刷工艺 标称阻值 100kΩ(编码1003) 阻值精度±1% 功率额定值 250mW(1/4W) 25℃常温下额定功率 电压额定值 200V 直流/交流峰值电压上限 温度系数(TCR) ±100ppm/℃ 0-60℃范围内典型值 工作温度范围 -55℃ ~ +155℃ 工业级宽温耐受性 封装尺寸 1206(公制3216) 3.2×1.6mm贴片封装,适配回流焊 品牌 KOA 日本原厂工艺,可靠性认证工作温度覆盖**-55℃至+155℃**,远超普通民用级电阻(-40~85℃),可稳定工作于高温工业环境(如电机控制柜、汽车发动机舱周边)或低温户外场景(如北方户外通信设备),无需额外温度补偿电路。
200V电压额定值避免了低电压电阻的击穿风险,适用于电源分压、高压信号滤波、射频匹配等中高压电路,满足工业控制、通信设备的信号传输需求。
±100ppm/℃的温度系数意味着:当环境温度变化100℃时,阻值变化不超过0.01%,在温度波动较大的工业场景中仍能保持电路参数稳定,降低系统调试难度。
KOA厚膜工艺确保批量产品阻值偏差控制严格(符合±1%精度要求),通过AEC-Q200等可靠性测试(车载级标准),可应对长期高温、湿度循环等严苛环境,适合量产应用。
1206封装体积小,便于PCB高密度布局,适配现代电子设备小型化、轻量化的设计趋势,同时兼容回流焊、波峰焊等主流贴片工艺。
高温环境下需降额使用:参考KOA官方曲线,125℃以上降额50%,155℃时建议功率不超过175mW(额定值的70%),避免电阻过热失效。
电路峰值电压不得超过200V,若应用场景电压更高(如300V),需串联电阻或更换更高电压额定值的型号(如RK73H系列250V版本)。
回流焊需遵循KOA推荐曲线:峰值温度240~250℃,持续时间≤10秒;波峰焊温度≤260℃,避免焊接温度过高损坏电阻基体。
若电路精度要求>1%(如精密仪器),需选择0.1%精度型号;若温度变化>100℃,建议增加温度补偿电路(如NTC热敏电阻并联)。
未使用电阻应储存在**-40~85℃、相对湿度≤85%** 的环境中,避免暴露于潮湿、腐蚀性气体(如硫化物),储存期建议不超过12个月。
KOA作为日本老牌电子元器件厂商,拥有50+年厚膜电阻研发制造经验,产品符合RoHS、REACH等环保指令,批量一致性优异(同批次阻值偏差≤0.5%),可降低客户选型风险,适合对可靠性要求较高的工业、汽车领域。
RK73H2BTTD1003F凭借平衡的性能参数(精度、功率、电压、温度范围)和KOA的可靠性保障,成为中小功率、中高压电路的高性价比选型,可广泛适配多种应用场景的设计需求。
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