Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RK73H2ATTD1002F是日本KOA公司推出的通用型厚膜贴片电阻,属于经典RK73系列,主打小封装、稳定精度与宽温适应性,适配多数电子设备的信号调理、电源滤波等场景。核心基础参数如下:
±1%精度属于工业级通用精度,远高于±5%的民用级电阻,可满足电路中分压比、信号偏置、匹配网络等对阻值一致性要求较高的场景。例如在模拟信号调理电路中,该电阻可避免因阻值偏差导致的信号失真;且KOA厚膜工艺的一致性控制使批量产品阻值离散性极小(典型测试数据:批量偏差≤±0.8%)。
250mW额定功率适配低功耗电路(如传感器前端、MCU外围电路),结合150V最大工作电压,覆盖多数低压/中压场景(如12V/24V电源滤波、100V以下信号传输)。需注意:高温环境需降额——125℃时额定功率降为180mW,155℃时降至150mW,避免热过载。
±100ppm/℃的TCR意味着温度每变化1℃,阻值变化≤0.01%。以-55℃→155℃的极端温差(210℃)计算,总阻值变化≤±2.1%,叠加±1%初始精度后仍在电路容错区间内(如工业PLC模拟量输入允许±3%偏差),适配工业现场高低温变化。
0805是目前电子设备最常用的贴片封装之一,小巧尺寸显著提升PCB布线密度,适配手机、智能穿戴、工业控制器等对空间要求严格的产品。同时支持回流焊、波峰焊,无铅焊接兼容RoHS 2.0标准,适配绿色制造需求。
相比薄膜电阻(成本高、精度更高),RK73H2ATTD1002F采用丝网印刷+高温烧结工艺,在保证基本性能的前提下降低制造成本,适合批量应用(如家电、通信设备量产)。KOA优化后的工艺使电阻膜层附着力强、耐磨损,长期使用阻值漂移极小。
结合参数特点,该电阻核心应用场景包括:
KOA对该型号进行严格可靠性测试,关键指标如下:
RK73H2ATTD1002F是一款高性价比厚膜贴片电阻,以0805小封装、±1%稳定精度、宽温适应性为核心优势,经市场验证可靠性强,是工业、消费、通信等领域的通用选型之一。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products