WMSIC Electronic Components

KOA RK73H2ATTD1002F

ModelRK73H2ATTD1002F
Package0805
BrandKOA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KOA RK73H2ATTD1002F
Type
KOA
Unit
Electronic Component
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KOA
Electronic Component
RK73H2ATTD1002F
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.027g
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM0264924508
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RK73H2ATTD1002F 厚膜贴片电阻产品概述

一、产品基本定位与核心参数

RK73H2ATTD1002F是日本KOA公司推出的通用型厚膜贴片电阻,属于经典RK73系列,主打小封装、稳定精度与宽温适应性,适配多数电子设备的信号调理、电源滤波等场景。核心基础参数如下:

  • 封装规格:0805(英制)/2012(公制,尺寸2.0mm×1.2mm×0.5mm);
  • 阻值:10kΩ(阻值代码“1002”,即100×10²Ω);
  • 精度等级:±1%(F级,符合IEC 60115标准);
  • 额定功率:250mW(25℃环境下);
  • 最大工作电压:150V(直流/交流峰值);
  • 温度系数(TCR):±100ppm/℃;
  • 工作温度范围:-55℃~+155℃。

二、核心性能的应用价值

2.1 精度与阻值稳定性

±1%精度属于工业级通用精度,远高于±5%的民用级电阻,可满足电路中分压比、信号偏置、匹配网络等对阻值一致性要求较高的场景。例如在模拟信号调理电路中,该电阻可避免因阻值偏差导致的信号失真;且KOA厚膜工艺的一致性控制使批量产品阻值离散性极小(典型测试数据:批量偏差≤±0.8%)。

2.2 功率与电压耐受

250mW额定功率适配低功耗电路(如传感器前端、MCU外围电路),结合150V最大工作电压,覆盖多数低压/中压场景(如12V/24V电源滤波、100V以下信号传输)。需注意:高温环境需降额——125℃时额定功率降为180mW,155℃时降至150mW,避免热过载。

2.3 宽温适应性

±100ppm/℃的TCR意味着温度每变化1℃,阻值变化≤0.01%。以-55℃→155℃的极端温差(210℃)计算,总阻值变化≤±2.1%,叠加±1%初始精度后仍在电路容错区间内(如工业PLC模拟量输入允许±3%偏差),适配工业现场高低温变化。

三、封装与工艺优势

3.1 0805封装适配高密度设计

0805是目前电子设备最常用的贴片封装之一,小巧尺寸显著提升PCB布线密度,适配手机、智能穿戴、工业控制器等对空间要求严格的产品。同时支持回流焊、波峰焊,无铅焊接兼容RoHS 2.0标准,适配绿色制造需求。

3.2 厚膜工艺平衡成本与性能

相比薄膜电阻(成本高、精度更高),RK73H2ATTD1002F采用丝网印刷+高温烧结工艺,在保证基本性能的前提下降低制造成本,适合批量应用(如家电、通信设备量产)。KOA优化后的工艺使电阻膜层附着力强、耐磨损,长期使用阻值漂移极小。

四、典型应用场景

结合参数特点,该电阻核心应用场景包括:

  1. 消费电子:手机音频电路分压、智能穿戴传感器偏置电阻;
  2. 工业控制:PLC模拟量输入模块、电机驱动低功耗电流采样;
  3. 通信设备:路由器/交换机电源滤波网络、射频电路匹配电阻;
  4. 汽车电子:车身控制模块(BCM)辅助电路、胎压监测(TPMS)信号调理(适配-40℃~125℃汽车环境)。

五、可靠性与环境适应性

KOA对该型号进行严格可靠性测试,关键指标如下:

  • 高温负载寿命:125℃、额定功率下测试1000小时,阻值变化≤±0.5%;
  • 温度循环测试:-55℃→155℃循环500次,阻值变化≤±0.3%,无外观损坏;
  • 湿热测试:85℃、85%RH环境下测试1000小时,阻值变化≤±0.4%,满足潮湿户外场景(如通信基站)需求。

总结

RK73H2ATTD1002F是一款高性价比厚膜贴片电阻,以0805小封装、±1%稳定精度、宽温适应性为核心优势,经市场验证可靠性强,是工业、消费、通信等领域的通用选型之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.