WMSIC Electronic Components

KOA RK73H1ETTP1802F

ModelRK73H1ETTP1802F
Package0402
BrandKOA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KOA RK73H1ETTP1802F
Type
KOA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KOA
Electronic Component
RK73H1ETTP1802F
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.011g
Electronic Component
18kΩ
Electronic Component
1
Electronic Component
BM0263523074
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RK73H1ETTP1802F 厚膜贴片电阻产品概述

RK73H1ETTP1802F是日本KOA公司推出的小功率高精度厚膜贴片电阻,采用0402(公制1005)超小型封装,专为高密度、高精度电子电路设计,具备宽温适应性与稳定可靠性,可满足便携电子、工业控制、汽车电子等多领域的小信号应用需求。

一、产品核心定位与应用场景

该电阻聚焦小型化、高精度信号级电路,核心解决传统插件电阻无法满足的高密度PCB布局需求,同时通过±1%精度、宽温范围覆盖从消费电子到工业级的应用场景:

  • 针对便携设备的空间限制,0402封装可大幅提升PCB单位面积的元件密度;
  • 1%精度满足信号调理、分压网络、反馈电路等对阻值准确性要求较高的场景;
  • -55℃~+155℃宽温范围,适配工业现场的极端温度变化与汽车内部的高温环境。

二、关键技术参数详解

RK73H1ETTP1802F的核心参数围绕“高精度、小功率、宽温”设计,关键指标如下:

  1. 阻值与精度:标称阻值18kΩ,精度±1%(符合E96系列电阻的精度标准),阻值一致性优于行业通用要求,可减少电路调试中的参数偏差;
  2. 功率与电压:额定功率100mW(小信号级功率,不适合大电流功率电路),最大工作电压75V(需注意:实际工作电压需同时满足功率约束——V≤√(P×R)=√(0.1W×18kΩ)≈42.4V,避免因电压过高导致功率超额定);
  3. 温度特性:温度系数(TCR)±100ppm/℃,即温度每变化1℃,阻值变化±0.01%(18kΩ下变化约1.8Ω),可满足温度波动不大的环境下的稳定工作;
  4. 工作温度范围:-55℃+155℃,覆盖工业级(-40℃+85℃)与汽车级(部分场景-40℃~+125℃)的温度需求,极端温度下性能稳定。

三、封装与物理特性

采用0402超小型贴片封装(英制代码,对应公制1005:长度1.0mm±0.2mm,宽度0.5mm±0.2mm,厚度0.35mm±0.05mm),具备以下特点:

  • 陶瓷基底+厚膜印刷工艺:厚膜电阻通过印刷银浆、电阻浆于氧化铝陶瓷基底,烧结后形成稳定的电阻体,成本可控且可靠性优于碳膜电阻;
  • 尺寸紧凑:仅为传统0805封装的1/4左右,适合智能手机、智能手表等便携设备的高密度PCB布局;
  • 表面贴装兼容性:支持回流焊、波峰焊等主流SMT工艺,焊接牢固,抗振动冲击能力强。

四、可靠性与环境适应性

RK73H1ETTP1802F通过KOA成熟的厚膜工艺与可靠性测试,具备以下环境适应性:

  • 抗湿性能:陶瓷基底防潮性好,可在湿度0~95%RH(无凝露)的环境下长期工作;
  • 抗浪涌能力:厚膜电阻体的浪涌耐受能力优于薄膜电阻,可承受短时间内的电压/电流波动(需注意不超过额定参数);
  • 振动与冲击:符合IEC 60068-2-6(振动)与IEC 60068-2-27(冲击)标准,可适应工业设备的振动环境与汽车行驶中的冲击;
  • 长期稳定性:经过高温老化测试,阻值漂移率≤0.5%/1000小时,可保证电路长期工作的稳定性。

五、品牌与品质保障

作为日本KOA的产品,RK73H1ETTP1802F具备以下品质优势:

  • 品牌可靠性:KOA是全球知名的被动元件厂商,专注电阻、电容研发超过70年,产品一致性与可靠性获行业认可;
  • 批次一致性:采用自动化生产与严格的分选工艺,同一批次电阻的阻值偏差、TCR等参数一致性优于±0.2%,减少电路批量生产中的调试成本;
  • 技术支持:KOA提供完整的 datasheet 与应用技术支持,可帮助客户优化电路设计。

六、典型应用推荐

该电阻可广泛应用于以下场景:

  1. 便携电子设备:智能手机的信号调理电路、智能手表的传感器分压网络、蓝牙耳机的滤波电路;
  2. 工业控制模块:PLC的输入输出接口电阻、传感器信号放大电路的反馈电阻、工业仪表的校准电路;
  3. 汽车电子:车载信息娱乐系统的小信号电路、胎压监测模块的分压电阻、汽车仪表盘的背光控制电路;
  4. 消费电子:蓝牙音箱的音频信号放大电路、智能家电的控制接口电阻、无人机的飞行控制电路。

总结:RK73H1ETTP1802F以“超小型封装+高精度+宽温适应性”为核心优势,是高密度电子电路中小信号电阻的理想选择,可满足多领域的实用需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.