Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RK73B1ETTP5R6J 为 KOA 系列贴片厚膜电阻,封装为 0402(公制约 1.0 mm × 0.5 mm)。典型电气参数如下:阻值 5.6 Ω,允许偏差 ±5%(J),额定功率 0.1 W(100 mW),最高工作电压 75 V,温度系数(TCR)±200 ppm/℃,工作温度范围 -55℃ 至 +155℃。该器件面向通用电子电路的空间受限场合,提供稳定的基线阻值与经济的成本性能比。
RK73B1ETT 为厚膜(thick film)工艺制造,采用陶瓷基体与丝网印刷阻性薄膜,经过烧成与金属化电极处理。厚膜电阻的优点包括制造成本低、批量一致性好、对一般贴片焊接工艺兼容。0402 超小封装适合高密度 PCB 设计与移动终端、消费电子等对体积敏感的应用。
注:由于额定功率仅 100 mW,适合低功率或短脉冲场合,若存在持续高功率消耗或高热环境,应评估降额或选择更大功率等级元件。
该型号适合对精度要求一般(±5%)且空间受限的设计。若需要更高精度、低 TCR 或更高功率,应考虑更高等级的薄膜或金属膜电阻、或更大封装(0603、0805 等)。在存在更高工作电压或连续功率需求时,应优先选用功率等级更高且具有明确降额数据的型号。
总结:RK73B1ETTP5R6J 提供了小尺寸、成本友好且适合大批量贴装的通用电阻解决方案。设计时应注意功率、温度与电压限制,按应用需求评估降额与可靠性验证。若需更详细的电气特性、包装形式或降额曲线,建议参考 KOA 的官方规格书或联系供应商获取完整数据。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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