Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Littelfuse SPHV24-01ETG-C SPHV24
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Littelfuse SPHV24-01ETG-C
- Type
- LITTELFUSE
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LITTELFUSE
- Electronic Component
- SPHV24-01ETG-C
- Electronic Component
- 1
- Package
- SOD-882
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.013g
- Electronic Component
- 1
- Cj- Capacitor
- 17pF
- Electronic Component
- BM0000288374
- Voltage
- 50V
- Electronic Component
- IEC 61000-4-5；IEC 61000-4-2
- Current(Ir)
- 1uA
- Voltage(VBR)
- 26.7V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SPHV24-01ETG-C 产品概述
1. 产品简介
SPHV24-01ETG-C 是一款由 Littelfuse（美国力特）生产的高性能瞬态电压抑制（TVS）二极管，采用表面贴装型（SMD）封装，封装型号为 SOD-882。这款器件专为汽车和工业应用设计，具备出色的瞬态电压保护能力，能够有效抑制电力线路中的各种瞬态过电压，保护敏感元器件不受损伤。
2. 基本参数
- 安装类型: 表面贴装型
- 电压 - 箝位（最大值）: 50V
- 功率 - 峰值脉冲: 200W
- 电源线路保护: 无
- 电压 - 反向断态（典型值）: 24V（最大）
- 不同频率时电容: 17pF @ 1MHz
- 工作温度: -40°C ~ 125°C （TJ）
- 电流 - 峰值脉冲 (10/1000µs): 3A（8/20µs）
- 双向通道: 1
- 电压 - 击穿（最小值）: 26.7V
- 类型: 齐纳
3. 应用领域
SPHV24-01ETG-C 适合广泛的应用场景，尤其是在汽车电子和工业电子设备中。其高电压箝位能力和快速反应时间使其成为保护敏感电子元器件的理想选择。在现代汽车中，电子控制单元（ECU）、传感器与执行器需要受到保护，以避免静电放电（ESD）、浪涌电流和其他电气干扰的损害。此外，SPHV24-01ETG-C 的小型化设计使其适合空间狭小的电路板应用，符合现代电子产品对轻量化、紧凑型设计的需求。
4. 性能特点
SPHV24-01ETG-C 的设计具备多个卓越的性能特点：
- 高峰值脉冲功率: 能承受高达 200W 的峰值脉冲功率，使其能够有效吸收瞬态电压，保障电路稳定性。
- 快速反应时间: 通过 10/1000µs 的脉冲电流测试，电流峰值可达 3A（8/20µs），确保在瞬态事件中能够快速保护电路。
- 极宽工作温度范围: -40°C 至 125°C 的工作温度范围，使其在严苛环境条件下仍能可靠工作，这对于汽车和工业应用尤为重要。
- 很小的电容: 在 1MHz 的频率下，仅有 17pF 的电容，确保了高频信号的良好传递，避免了信号失真。
5. 封装与安装
SPHV24-01ETG-C 采用 SOD-882 小型封装，封装尺寸小，适合于自动化的表面贴装工艺，便于大规模生产和组装。这种设计不仅能够有效节省电路板空间，还提高了整体电路的布局灵活性，有助于减小电子设备的尺寸和重量。
6. 总结
总之，SPHV24-01ETG-C 是一款性能卓越可靠的瞬态电压抑制二极管，能够有效保护电子电路不受瞬态电压的威胁。其适用的广泛应用领域和优异的设计特性，使其成为现代电子产品中必不可少的保护元件。作为设计工程师或产品开发人员，在面对日益复杂和多变的电子应用需求时，SPHV24-01ETG-C 无疑是一个值得信赖的选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
