WMSIC Electronic Components

Littelfuse 0407005.WR 0407005

Model0407005.WR
Package1206
BrandLittelfuse
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Littelfuse 0407005.WR
Type
LITTELFUSE
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
LITTELFUSE
Electronic Component
0407005.WR
Electronic Component
1
Electronic Component
1.6mm
Package
1206
Type
SMD Fuse
Electronic Component
Non-Resettable Fuse
Electronic Component
0.163g
Electronic Component
3.2mm
Electronic Component
0.835mm
I2t
7.8
Electronic Component
1
Electronic Component
50A
Electronic Component
BM0229969058

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0407005.WR 产品概述

一、产品定位与概述

0407005.WR 是 Littelfuse(美国力特)的一款贴片式微型熔断器,采用 1206(3.2 mm × 1.6 mm)封装,属于 T‑LAG(时间延迟 / 慢断)型保护器件。其设计用于对电路过流和短路故障提供可靠保护,同时允许短时浪涌电流通过而不发生误熔断,适合对浪涌有一定容忍需求的便携与工业电子设备。

(注:所给基础参数中额定电压存在两处说明不一致——一处为 32 V,描述中有“63V”字样。请在最终选型前以厂方数据手册或样品标注为准。)

二、主要电气参数

  • 额定电流:5 A
  • 额定电压:32 V(请确认是否为 63 V)
  • 熔断 I2t:7.8(典型,单位按厂方数据手册为 A²s)
  • 分断能力:50 A(典型峰值短路开断能力)
  • 类型:贴片式熔断器,时间延迟(T‑LAG)

三、机械与环境特性

  • 封装尺寸:1206(约 3.2 mm × 1.6 mm)
  • 工作温度范围:-55 ℃ 至 +150 ℃
  • 适合表面贴装工艺,需按厂家推荐回流焊温度曲线焊接

四、产品特点与优势

  • 微型化封装,节省 PCB 面积,适用于空间受限的系统设计;
  • T‑LAG 特性使其对短时浪涌有良好耐受性,减少误熔断,适合启动电流或瞬态脉冲较大的电路;
  • 宽温度范围与较高的分断能力,提升在工业与车规类应用中的可靠性;
  • Littelfuse 品牌保证,质量与一致性可追溯。

五、典型应用场景

  • 移动设备、平板、笔记本及 USB/充电电路输入保护;
  • 电池管理与便携电源保护;
  • 工业控制器、通信设备及消费电子的板级过流保护;
  • 对瞬态浪涌有容忍需求的电源模块与接口电路。

六、选型与使用注意事项

  • 核实额定电压:32 V 与 63 V 的差异会显著影响适用场景与安全裕度;请以官方数据手册为准;
  • 长期工作电流建议参考厂方热稳定性曲线,避免在额定值附近持续工作以防热漂移;通常在额定电流的 60%~80% 范围内有更佳长期可靠性(以具体曲线为准);
  • 焊接与回流:遵循 Littelfuse 的回流温度曲线与湿度处理规定,避免超过推荐峰值温度和时间;
  • 设计 PCB 焊盘时考虑热阻与散热路径,确保在高电流下器件不过热;
  • 在需要更高分断能力或更快动作的场合,考虑替代型号或并联/保护级联方案。

七、封装与采购信息

  • 封装:1206 SMD;品牌:Littelfuse(美国力特);型号标识:0407005.WR。
  • 采购时请确认完整型号、额定电压与时间特性,并索取最新数据手册和认证资料以满足应用与法规要求。

如需我为您查找并比对 Littelfuse 官方数据手册、或根据具体应用(工作电流、启动浪涌、电压等级)推荐相近型号与 PCB 封装建议,请提供应用场景与目标环境。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.