WMSIC Electronic Components

Littelfuse SMD075F/60-2 SMD075F

ModelSMD075F/60-2
PackageSMD-2
BrandLittelfuse
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Littelfuse SMD075F / 60-2
Type
LITTELFUSE
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LITTELFUSE
Electronic Component
SMD075F/60-2
Electronic Component
1
Package
SMD-2
Electronic Component
Resettable Fuse
Electronic Component
0.43g
Electronic Component
1
Electronic Component
800ms
Electronic Component
BM0258853354
Voltage Rating(Vmax)
60V
Power(Pd)
1.7W
Current(Imax)
10A
Electronic Component
Electronic Component
Electronic Component
2000
Latching Current(Ihold)
750mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD075F/60-2(Littelfuse PolySwitch)产品概述

一、产品简介

SMD075F/60-2 为 Littelfuse SMD 系列的可复位聚合物自恢复保险丝(PolySwitch),封装为 SMD-2,额定耐压 60V。器件在过流或短路情况下通过正温度系数(PTC)效应迅速增阻限流,故障消除后冷却恢复导通,适合表面贴装的保护方案,广泛应用于便携设备、通信接口、电源输入及电池保护等场景。

二、主要参数(主要规格一览)

  • 最大工作电压(Vmax):60V
  • 最大允许电流(Imax):10A(冲击能力)
  • 保持电流(Ihold):0.75A(750mA)——在此电流及以下器件长期保持闭合状态
  • 跳闸电流(Itrip):1.5A —— 在此电流条件下器件在规定时间内进入高阻态
  • 功耗(Pd):1.7W(器件最大耗散功率,注意热管理)
  • 初始态阻值(Rmin):350 mΩ(初态低阻,影响电压降与功耗)
  • 跳断后阻值(R1max):1Ω(高阻态限流性能)
  • 动作时间:約 800ms(从过流到进入高阻态的典型时间)

三、工作原理与行为特性

PolySwitch 以导电聚合物为核心,当通过器件的电流超过器件的热触发点时,内部温度上升导致电阻迅速增大,从而限制电流并降低系统损伤。降温后材料恢复原有低阻态,实现自动复位。器件的 Ihold 与 Itrip 由温度与电流相互作用决定,实际动作受环境温度、PCB 散热与重复冲击影响。

四、应用建议与选型要点

  • 按实际工作电流选择:工作电流应显著低于 Ihold,留有余量以避免误动作。
  • 注意冲击能力:Imax=10A 表示能承受瞬态冲击,但不等同于长期过流容量。
  • 考虑电压降与功耗:在 0.75A 条件下,典型压降约 0.26V(0.75A×0.35Ω),在设计电源效率与热预算时需计算。
  • 热环境与散热:Pd=1.7W 为器件能耗上限,应通过 PCB 铜箔、散热路径与布置降低结温,避免因环境高温降低 Itrip。

五、封装与安装要点

  • 封装 SMD-2,适合自动贴装与回流焊;焊接时应遵循厂商推荐回流曲线以保证可靠性。
  • 布局建议提供充足的铜箔散热区,避免将热源集中在器件附近。器件冷却不良会导致动作电流下降、误跳频率上升。
  • 严禁用导线或锡桥替代复位保险丝,发生保护动作后需排查原因并确认系统无短路再复位。

六、典型应用场景

  • USB / I/O 接口过流保护
  • 电池组与充电线路短路保护
  • 电源输入与局部供电分支保护
  • 通信设备、移动设备、便携式电源防护

七、可靠性与维护

器件为可复位保护元件,频繁过流会影响寿命与触发特性。建议在设计中保留足够的裕量,出现反复跳闸应查明根本原因并修复故障点。长期存放与高温环境会改变特性,装配与使用时遵从厂方规格书可获得最佳性能与可靠性。

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