Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LITEON LTV-357T-C
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- LITEON LTV-357T-C
- Type
- LITEON
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- LITEON
- Electronic Component
- LTV-357T-C
- Electronic Component
- 1
- Package
- 4-SOP
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0.227g
- Electronic Component
- 1
- Electronic Component
- 3us
- Electronic Component
- BM0000000636
- Operating Temperature
- 55℃~+110℃
- Load Voltage
- 35V
- Type
- DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LTV-357T-C 产品概述
引言
LTV-357T-C 是由台湾光宝 (LITEON) 生产的一款高性能光耦合器，采用4-SOP封装，专为低功耗、高效率应用而设计。作为一款晶体管输出的光电耦合器，LTV-357T-C 在电气隔离、信号传输以及噪声抑制方面提供了出色的性能，广泛应用于通信、工控、医疗设备等领域。
主要特性
通道数: 本产品为单通道设计，适合于一些对单一信号进行隔离及传输的应用。
电压隔离: LTV-357T-C 提供高达3750Vrms的电压隔离，确保在高压环境中保护信号线和相关电路的安全性，同时有效地防止干扰和信号失真。
电流传输比: 在5mA的工作条件下，该器件的电流传输比在200%到400%之间。高电流传输比确保在低输入电流条件下，仍能获得足够的输出，从而提升了信号的完整性和可靠性。
快速响应时间: 此款光耦的上升和下降时间分别为4µs和3µs，确保能够应对快速变化的信号，适用于通信和高频信号传输。
输入与输出类型: 采用DC输入，晶体管输出的设计，使其在逻辑电平转换及信号传递方面表现优异。能有效接口处理逻辑信号到功率信号的转换，灵活应用于多种电路。
输出特性: 其输出电压最大为35V，输出电流可达50mA，对于复杂的负载驱动需求具有良好的适应性。同时，电流-DC正向(If)的最大值为50mA，确保了器件在运作中的稳健性和稳定性。
低饱和压降: 该光耦的Vce饱和压降最大为200mV，能够在负载条件下保持较小的功耗，提高整体系统的能效。
工作温度范围: LTV-357T-C 的工作温度范围为-55°C至110°C，能够适应恶劣的环境条件，确保在各种工业应用中均可正常工作。
便于安装: 4-SMD鸥翼封装使得该器件具备良好的表面贴装能力，便于大规模生产和贴片。
应用领域
LTV-357T-C 由于其独特的性能特点，广泛应用于以下领域：
- 通信设备: 用于信号隔离和处理，尤其是在逻辑电平转换的场合。
- 工业控制: 可应用于各种传感器、电机控制及系统监控的信号传递，确保系统的稳定性和安全性。
- 医疗设备: 在医疗监测仪器中，提供关键的信号隔离和转发，以确保患者安全及设备可靠运行。
- 消费者电子: 应用于各种家电和电子产品中，为控制电路提供安全隔离和信号传递。
小结
LTV-357T-C 是一款集成了高电压隔离、快速响应、宽工作温度范围的光耦合器，尤其适合于工业及高安全性要求的应用。其卓越的电气性能使其成为各类电子设备中不可或缺的重要元件。选用 LTV-357T-C，不仅能够提升产品性能，更能保障整体系统的安全性与稳定性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
