Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LGE MBR0530
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LGE MBR0530
- Type
- LGE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LGE
- Electronic Component
- MBR0530
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Electronic Component
- BM0226478699
- Current
- 500mA
- Diode
- Electronic Component
- Current(Ir)
- 20uA@30V
- (Vf)
- 550mV@500mA
- Electronic Component
- 55℃~+175℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MBR0530 产品概述
一、主要特性
MBR0530 为独立式肖特基整流二极管，鲁光（LGE）品牌，适用于中低电流、高效率的整流与保护场合。主要参数如下：
- 正向压降 Vf = 550 mV @ IF = 500 mA；
- 直流反向耐压 Vr = 30 V；
- 反向电流 Ir = 20 µA @ Vr = 30 V；
- 整流电流（额定）Io = 500 mA；
- 非重复峰值浪涌电流 Ifsm = 15 A（单次脉冲）；
- 工作结温范围：-55 ℃ 至 +175 ℃；
- 封装：SOD-123FL，独立器件。
这些参数表明 MBR0530 在中等直流电流下具有较低的正向压降和较小的反向泄漏，能有效降低功耗与热耗散。
二、典型应用
- 开关电源二次整流（低电流分支）；
- 电池供电设备的反向保护与防倒灌；
- DC-DC 转换器输出整流；
- 信号线路或小功率电源的整流与钳位；
- 快速恢复与反向保护场合，需兼顾体积与效率时优先选择。
三、电气与热特性说明
- 正向压降 550 mV（500 mA）有利于降低功耗，适合对电压损耗敏感的移动或低功耗系统；
- 反向电流 20 µA 在 30 V 时保持较低泄漏，适合待机或漏电敏感的应用；
- 非重复峰值浪涌 15 A 适用于开机或短时冲击电流，但不宜作为长期重复冲击使用；
- 虽然最高结温达 175 ℃，建议在设计中预留热裕量并通过合理散热与走线来降低结温以提高长期可靠性。
四、封装与 PCB 布局建议
- SOD-123FL 为小型表贴封装，适合高密度布局；焊盘应按照厂商建议尺寸设计，保证良好焊接与热传导；
- 为控制结温，建议将二极管的引脚连至较宽的铜箔，必要时在底层开通散热铜皮或布置过孔以改善散热；
- 布线尽量短且粗，降低寄生电感与压降；靠近负载或输出电容放置，减少回路面积与 EMI。
五、选型与注意事项
- 若工作电流常态高于 500 mA，或有频繁大浪涌，应选用更大电流额定或更高浪涌能力的器件；
- 对于高反向电压或高温环境，应留有安全裕度，考虑反向电压及温度对泄漏电流和功耗的影响；
- 检验封装与回流焊工艺兼容性，SOD-123FL 对应多数 SMT 工艺，但需遵循湿敏等级与回流曲线要求。
六、可靠性与采购建议
- MBR0530 适合需要低 Vf 与低 Ir 的常规电子产品；在量产时应进行批次验收测试（Vf、Ir、耐压、外观）；
- 采购时确认供应商（鲁光）资质与包装、出厂检验报告，要求明确存储与运输条件，避免受潮影响焊接可靠性。
MBR0530 以其低压降、低泄漏和小封装的组合，适合众多中低功率整流与保护应用。合理的热设计与布线能发挥其最佳性能并保证长期可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
