WMSIC Electronic Components

LGE BZX55C12

ModelBZX55C12
PackageDO-35
BrandLGE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LGE BZX55C12
Type
LGE
Minimum package
5000

Technical parameters

Electronic Component
LGE
Electronic Component
BZX55C12
Electronic Component
1
Package
DO-35
Electronic Component
Zener Diode
Electronic Component
0.14g
Electronic Component
1
(Zzk)
90Ω
(Zzt)
20Ω
Electronic Component
BM0259723006
Diode
1
Power Dissipation(Pd)
500mW
Electronic Component
11.4V~12.7V
Electronic Component
5000
Electronic Component
12V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZX55C12(LGE 鲁光)产品概述

一、产品简介

BZX55C12 是一款独立式(分立)稳压二极管,标称稳压值 12V,常用作低功耗的基准源、箝位与稳压保护元件。该器件以 DO-35 轴向玻璃封装提供,体积小、可靠性高,适合穿孔安装与手工焊接。品牌:LGE(鲁光)。

二、主要电气参数

  • 标称稳压值(VZ):12V(标称)
  • 稳压值允许范围:11.4V ~ 12.7V(常见规格 11.4V ~ 12.6V)
  • 反向漏电流(Ir):100 nA @ 9.1 V
  • 耗散功率(Pd):500 mW(器件最高耗散)
  • 稳态阻抗(Zzt):20 Ω(在规定测试电流下)
  • 膝部阻抗(Zzk):90 Ω(低电流区)
  • 封装:DO-35(轴向玻璃)

三、性能要点

  • 低漏电流:在接近稳压区的低电压条件下,漏电流非常小(100 nA 级),适合静态功耗敏感的应用。
  • 动态阻抗:Zzt 约 20 Ω,说明在测试电流附近输出阻抗较低,有利于维持稳压精度;Zzk 较大,表示在非常小电流下稳压性能下降,需要保证足够的工作电流。
  • 功率限制:单体耗散上限 500 mW,对应最大连续逆向电流约 41.7 mA(Pd/VZ),但推荐工作电流大幅低于此值以提高可靠性与热稳定性。

四、典型应用场景

  • 低功耗基准电压:为模拟前端或数模转换器提供参考电压(非高精度场合)。
  • 过压或浪涌箝位:保护小信号电路中的输入端与敏感芯片。
  • 电平移位与逻辑保护:在接口电路中作为稳压/参考元件使用。
  • 仪表与消费电子:电源辅助稳压、充电与反馈电路等。

五、设计与使用建议

  • 串联限流电阻设计:稳压二极管需与串联电阻配合工作,R = (Vin - VZ) / Iz_total,其中 Iz_total 为稳压二极管工作电流(含漏电与负载电流)。
  • 功耗检查:计算二极管耗散 Pd = VZ × Iz,并保证 Pd 不超过额定 500 mW;为延长寿命与保证热裕量,建议实际耗散控制在额定值的 40%60% 以下(例如 Iz ≲ 1520 mA)。
  • 温度漂移:12V 区域的齐纳/稳压二极管一般具有正温度系数,设计时需考虑温度对输出电压的影响,精密应用建议做温度补偿或选择专用基准源。
  • 启动与低电流区:Zzk 值较高,表明在极低电流下稳压能力变差,设计时应确保有足够的偏流通过二极管以进入稳压区。

六、封装与可靠性

DO-35 轴向玻璃封装具备良好的机械强度与电绝缘性,适合穿孔板或少量批量焊接。注意焊接热阻及手工焊接时间,避免对玻璃封装和引线造成热应力或机械损伤。长期可靠性与一致性受制造批次影响,量产设计建议留取批次验证。

七、选型注意事项

  • 如果需要高精度低温漂参考,请考虑专用基准源(如低漂移基准芯片)而非普通稳压二极管。
  • 若电路工作电流较大或需更低静态阻抗,应选用额定功率更高或动态阻抗更低的型号。
  • 对于自动化贴装或要求更高机械强度的场合,确认封装形式(DO-35)是否满足装配工艺要求。

此款 BZX55C12(LGE 鲁光)以其简单、低成本和适用性广的特点,适合用于中低功耗的稳压与保护场合。设计时重视功率散热、工作电流与温度影响,可获得稳定可靠的使用效果。

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