WMSIC Electronic Components

LGE SB15U50SL

ModelSB15U50SL
PackageTO-277B
BrandLGE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LGE SB15U50SL
Type
LGE
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LGE
Electronic Component
SB15U50SL
Electronic Component
1
Package
TO-277B
Electronic Component
Schottky Diode
Electronic Component
1g
Electronic Component
1
Electronic Component
BM0230873934
Current
15A
Diode
1
Current(Ir)
10uA
(Vf)
790mV@15A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
5000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SB15U50SL 产品概述

一、概述

SB15U50SL 是由 LGE(鲁光) 提供的一款单颗独立式整流/功率二极管,适用于需承受较大正向电流与瞬态浪涌的中功率电源场合。器件在高电流条件下具有较低的正向压降及较小的反向泄漏,适合整流、回驰与保护等用途。

二、主要规格与特性

  • 二极管配置:1个独立式
  • 正向压降 (Vf):0.79 V @ 15 A
  • 直流反向耐压 (Vr):105 V
  • 最大整流电流:15 A(DC)
  • 反向电流 (Ir):10 μA(通常额定工况)
  • 非重复峰值浪涌电流 (Ifsm):220 A(单次脉冲能力)
  • 工作结温范围:-55 ℃ ~ +150 ℃

以上指标表明该器件适合持续15A整流使用,并能承受短时大电流浪涌,但浪涌脉冲的波形与宽度需参考完整数据手册以确定允许值。

三、封装与机械特性

封装:TO-277B。此类金属导热型封装便于直接安装在散热器上或通过螺栓固定以获得良好散热路径。安装时注意正确绝缘与紧固扭矩,避免应力集中或热阻增大。

四、热管理与散热设计

在15A工作点下,二极管的正向功耗近似为 P = Vf × If ≈ 0.79 V × 15 A ≈ 11.85 W(持续)。因此:

  • 必须采用适当散热器或将器件紧固在机箱散热面上,以保证结温不超过最大允许值。
  • 关注环境温度与散热器热阻的匹配,必要时加风冷或增加散热面积。
  • 高频脉冲或重复浪涌会显著提升瞬时温升,需按厂方浪涌曲线评估使用寿命与安全裕量。

五、典型应用场景

  • 开关电源整流桥或单端整流
  • 电机驱动与功率逆变的回驰二极管
  • 电池充放电管理与车载电源(在电压与温度要求匹配前提下)
  • 工业电源、LED驱动及通用整流应用

六、可靠性与使用注意事项

  • 反向泄漏随结温升高而增加,长期高温工作会加速老化并降低安全裕度。
  • Ifsm 为非重复峰值浪涌能力,重复或长期脉冲应参照厂方波形和允许次数限制。
  • 安装时确保良好电气接触与热界面材料(如导热硅垫),避免接触电阻引发局部过热。
  • 在设计中应适当留有电流和温升裕量,防止接近极限长期运行。

七、选型与替代建议

选择时应核实实际系统最大反向电压是否≤105 V,并评估正常工作电流、峰值浪涌与结温环境。若系统需要更高耐压或更低正向压降,可参考同类封装下高压或低Vf的型号;若散热受限,考虑并联多只或选择更低热阻封装。购买与替换时建议查询鲁光完整规格书以获取更多波形与热特性曲线。

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