WMSIC Electronic Components

LGE 2EZ12D5

Model2EZ12D5
PackageSMB
BrandLGE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LGE 2EZ12D5
Type
LGE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LGE
Electronic Component
2EZ12D5
Electronic Component
1
Package
SMB
Electronic Component
Zener Diode
Electronic Component
0.307g
Electronic Component
1
(Zzk)
700Ω
(Zzt)
4.5Ω
Electronic Component
BM0230873928
Diode
1
Current(Ir)
1uA
Power Dissipation(Pd)
1.5W
Electronic Component
11.4V~12.6V
Electronic Component
55℃~+175℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2EZ12D5 产品概述

一、产品简介

2EZ12D5 是鲁光(LGE)生产的独立式稳压二极管,标称稳压值 12V,允许稳压范围 11.4V–12.6V,封装为 SMB(表面贴装中型封装)。该器件设计用于在功率耗散受控的条件下提供稳定的参考电压或过压钳位,适用于工业级电子设备及汽车电子等对温度与可靠性要求较高的场合。

二、主要性能参数

  • 稳压值(标称):12V
  • 稳压范围:11.4V ~ 12.6V
  • 反向电流 Ir:1 μA(典型/保证值)
  • 最大耗散功率 Pd:1.5 W(在指定散热条件下)
  • 阻抗 Zzt:4.5 Ω
  • 阻抗 Zzk:700 Ω
  • 工作结温范围:-55 ℃ ~ +175 ℃
  • 封装:SMB(便于表面贴装及自动化生产)

三、主要特性与优势

  • 稳定性好:较低的阻抗(Zzt = 4.5 Ω)在工作电流区间能提供更平坦的稳压特性,适合做参考或偏置源。
  • 低漏电:反向漏电仅 1 μA,有利于低功耗电路和精密参考场合。
  • 宽温度范围:-55 ℃ 至 +175 ℃ 的工作结温支持汽车级和工业级环境。
  • SMB 封装:兼顾热耗散和装配可靠性,适合回流焊与波峰焊工艺。

四、典型应用场景

  • 电源基准/参考电压源;
  • 电压钳位与瞬态保护(非专用 TVS 的补充用途);
  • 线性稳压器中的误差放大器偏置;
  • 工业控制、通信设备及汽车电子中的本地稳压模块。

五、封装与热管理建议

SMB 封装在1.5W 最大耗散下对 PCB 散热依赖较大。设计时应:

  • 在 PCB 上为器件底部与相邻铜箔提供足够散热面积(加铜填充、热过孔);
  • 根据实际工作环境对耗散功率进行降额(随结温升高,器件可承受功率下降),并确保结温不超过 +175 ℃;
  • 在高温或高功率场合考虑并联或选用更大功率的稳压方案。

六、使用注意事项

  • 反向电流与稳压精度会受工作电流和温度影响,设计时参考完整的电气特性曲线并选定合适的工作电流点;
  • 避免器件长期工作在最大耗散功率附近以延长可靠性;
  • 焊接工艺按厂家推荐曲线执行,避免超温导致参数漂移。

七、订购与质量保证

品牌:LGE(鲁光);型号:2EZ12D5;封装:SMB。建议向授权分销商索取器件详细数据手册、温度-功率降额曲线与可靠性试验报告以便于设计验证与量产。鲁光产品通常提供批次可追溯的质量控制支持,适用于需长期可靠性的应用。若需替代件或并联方案,可联系供应商获取支持。

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