Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LGE BZT52C3V3S
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LGE BZT52C3V3S
- Type
- LGE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LGE
- Electronic Component
- BZT52C3V3S
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Zener Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- (Zzk)
- 600Ω
- (Zzt)
- 95Ω
- Electronic Component
- BM0219835396
- Diode
- 1
- Current(Ir)
- 5uA@1V
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 3.1V~3.5V
- Electronic Component
- 65℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C3V3S 产品概述
一、产品简介
BZT52C3V3S是一款高性能的稳压二极管，属于LGE（鲁光）品牌的产品系列。该稳压二极管专为电子电路中提供稳定的电压参考而设计，主要适用于电源管理和电压保护应用。BZT52C3V3S的稳压电压为3.3V，适合许多低压电子设备的应用以及敏感电子组件的保护。
二、主要特点
- 稳压电压范围：BZT52C3V3S具备3.1V至3.5V的稳压电压范围，能够在不同的工作条件下实现稳定的输出，确保下游电路正常运行。
- 小巧封装：该元器件采用SOD-323封装，体积小巧，适合高密度电路设计，并能有效节省PCB空间。
- 低反向漏电流：在1V条件下仅有5μA的反向漏电流，这意味着BZT52C3V3S在不工作时的功耗极低，能大幅度提升电池供电设备的续航能力。
- 良好的温度稳定性：该元器件在较宽的温度范围内仍能保持良好的线性度和稳定性，适合多种环境条件下的工作。
- 高可靠性和耐久性：作为稳压二极管，BZT52C3V3S在电源设备和敏感电路中的应用使其具有较长的使用寿命与高耐久性。
三、应用场景
BZT52C3V3S广泛适用于各种电子设备与系统，典型的应用场景包括：
- 电源管理系统：在电源转换器和电源监控电路中用作电压参考，确保输出电压的稳定性。
- 电池供电的设备：因其低反向漏电流特性，该稳压二极管非常适合与电池供电设备搭配使用，能够延长电池的使用时间。
- 保护电路：在各种敏感的电子组件上使用，帮助保护这些组件免受过压和电流尖峰的影响，确保其正常工作的稳定性。
- 通信设备：在通信设备、电信基站和网络设备中，作为电压稳定器出现在信号放大和调制解调器电路中。
- 消费类电子产品：在智能手机、可穿戴设备、平板电脑等消费类电子产品中，作为电路电压稳定的关键元件。
四、技术规格
- 型号：BZT52C3V3S
- 稳压电压：3.3V(典型值)
- 稳压电压范围：3.1V~3.5V
- 反向漏电流：5μA@1V
- 封装类型：SOD-323
- 品牌：LGE(鲁光)
五、使用注意事项
在使用BZT52C3V3S稳压二极管时，需要考虑以下几点以确保其最佳性能：
- 最大功率限制：确保使用的功率不会超过该元器件的最大额定值，以避免烧毁或失效。
- 反向电压：应该注意其反向电压不可超过额定值，以防止损坏。
- 热管理：在高功率应用中，尽量做好热管理，避免因发热过量导致的性能下降。
- PCB布局：合理布局电路PCB，以减少寄生电感和电容带来的影响，提高稳定性和可靠性。
六、总结
BZT52C3V3S作为一种具有高性能的稳压二极管，不仅在低功耗电子设备中展现出优异的性能特点，而且凭借其小巧的SOD-323封装与高耐久性，成为了众多电子设计师和工程师首选的电压管理解决方案之一。无论是在电源设计、保护电路还是在消费电子产品中应用，BZT52C3V3S都能够提供可靠的电压稳定性，助力现代电子技术的不断进步与创新。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
