Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LGE ES3G
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LGE ES3G
- Type
- LGE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LGE
- Electronic Component
- ES3G
- Electronic Component
- 1
- Package
- SMB
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 0.176g
- Electronic Component
- 1
- Electronic Component
- BM0257672018
- Current
- 3A
- Diode
- 1
- Current(Ir)
- 10uA@400V
- (Vf)
- 1.3V@3A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ES3G 快恢复/高效率二极管 — 产品概述
一、产品简介
ES3G 是鲁光（LGE）推出的一款独立式快恢复、高效率整流二极管，采用SMB（DO-214AA）封装，面向中高压开关电源与功率整流应用。器件在中等电流与高压环境下表现出低正向压降与快速恢复特性，可有效降低开关损耗与系统发热。
二、主要性能参数
- 正向压降 Vf：1.3V @ 3A
- 直流反向耐压 Vr：400V
- 连续整流电流 If(AV)：3A
- 反向电流 Ir：10µA @ 400V
- 反向恢复时间 Trr：35ns（快恢复）
- 非重复峰值浪涌电流 Ifsm：100A
- 工作结温范围 Tj：-55℃ ~ +150℃
- 封装：SMB（独立式）
- 品牌：LGE（鲁光）
三、性能亮点
- 低正向压降（1.3V@3A），在额定整流电流下可降低导通损耗（3A工况下正向功耗约3.9W），利于提高系统效率。
- 35ns 的快速恢复时间，有助于减少开关过渡期的能量回收与电磁干扰，特别适合高频开关电源和功率因数校正电路。
- 低反向漏电（10µA@400V），提高高压待机与阻断状态的可靠性与能效。
- 封装承受100A脉冲浪涌，抗冲击能力强，适合短时启动力矩或浪涌场合。
四、典型应用场景
- 开关电源（SMPS）整流与续流二极管
- PFC（功率因数校正）方案的整流单元
- 充电器、适配器的高压整流
- DC-DC变换器的快恢复整流
- 电机驱动与逆变器中的保护与续流电路
五、热管理与电气注意事项
- 在3A连续工况下，器件正向损耗显著，需结合合理的PCB散热（加宽铜箔、散热铜柱或散热片）以控制结温上升，保证长期可靠性。
- 反向恢复特性与电路寄生电感密切相关，推荐在布局时尽量缩短回流路径、减小串联电感以降低振铃与过冲。
- 虽具备100A峰值浪涌能力，但应避免频繁或长时间的浪涌操作，必要时在系统中加入限流或软启动保护。
六、封装与可靠性
SMB 独立式封装便于手工焊接与自动贴装，机械强度适中，适合批量生产与维修替换。器件工作结温范围宽（-55℃~+150℃），适应工业级温度要求。建议遵循厂方焊接与储存管理建议以确保焊接可靠性与封装完整性。
七、选型与使用建议
- 若需要更低导通损耗或更高频率开关，可对比肖特基与其它快恢复系列，依据系统允许的正向压降与反向耐压选择。
- 在样品验证阶段关注器件在目标工作温度与开关频率下的结温与EMI表现，必要时优化散热与布局。
- 订购时注明型号 ES3G、封装 SMB 及期望的检验和包装要求，并参考鲁光提供的详细数据手册以获取完整的电气特性曲线与焊接工艺建议。
如需器件详细数据手册或样品报价，可提供目标应用场景与批量需求，便于推荐更合适的器件与布局指导。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
