WMSIC Electronic Components

LGE BAT54S

ModelBAT54S
PackageSOT-23
BrandLGE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LGE BAT54S
Type
LGE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LGE
Electronic Component
BAT54S
Electronic Component
1
Package
SOT-23
Electronic Component
General Purpose Diode
Electronic Component
0.028g
Electronic Component
1
Electronic Component
BM0257672015
Current
200mA
Diode
1
Current(Ir)
2uA@25V
(Vf)
800mV@100mA
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BAT54S 产品概述

一、产品简介

BAT54S(品牌:LGE 鲁光)是一款面向通用电子应用的表面贴装二极管对,采用 SOT-23 封装,器件内部为一对串联配置的二极管。该器件设计用于在有限电流和中等反向电压条件下提供可靠的整流、钳位和保护功能。器件的工作结温范围宽(-55℃ 至 +150℃),适合多数工业及消费电子环境。

二、主要参数(基于所给规格)

  • 配置:1 对串联式二极管
  • 正向压降(Vf):约 800 mV @ 100 mA
  • 直流反向耐压(Vr):30 V
  • 额定整流电流:200 mA(连续)
  • 反向电流(Ir):2 µA @ 25 V
  • 非重复峰值浪涌电流(Ifsm):600 mA
  • 工作结温:-55 ℃ ~ +150 ℃
  • 封装:SOT-23(小外形,适用于高密度 PCB)

以上参数适合在典型低至中等功率场景中使用。请在实际设计中参考完整器件数据手册以获取具体温度与频率下的特性曲线与极限参数。

三、产品特点与优势

  1. 小型封装:SOT-23 封装占板面积小,利于高密度布板与自动贴片生产。
  2. 串联二极管结构:内部为一对串联的二极管,适合单通道的高压耐受或特定电平转换需求。
  3. 低反向漏电:在 25 V 下反向电流仅约 2 µA,有利于待机低功耗设计与微弱信号保持。
  4. 合理的浪涌耐受能力:600 mA 的非重复峰值浪涌电流能抵抗短时冲击(需注意热时限和应用环境)。
  5. 宽温范围:-55℃~+150℃ 的结温范围满足大多数工业级应用的可靠性需求。

四、典型应用场景

  • 低压整流与续流保护:适用于小型电源模块、充电电路与反向保护。
  • 电平钳位与保护:在接口电路或混合信号线路中用于钳位输入突波与防止反向击穿。
  • 信号复用/二极管 OR 逻辑:用于简单的逻辑或信号合并场景,特别是空间受限的便携设备。
  • 电池管理/充放电路径限制:用于微小电流路径管理和保护电路。
  • EMI/瞬态抑制的辅助作用:配合其他保护元件减轻瞬态冲击对后级电路的影响。

五、设计与使用建议

  1. 额定条件:连续整流电流 200 mA 是在一定散热条件下的额定值;若长期接近该电流,应评估 PCB 散热、环境温度和器件结温升。
  2. 浪涌处理:Ifsm 600 mA 为非重复峰值,适合短时冲击。若可能出现重复或长时间浪涌,应设计额外保护(如限流、热熔断或更大功率二极管)。
  3. 反向电压限制:工作中尽量使反向电压远低于 Vr=30 V,以延长寿命并减少漏电。
  4. 布局建议:SOT-23 引脚短且走线密集,建议将热量能有效传导到铜箔,必要时加大焊盘面积或多层铜平面以降低结温。
  5. 测试注意:在实际电路验证时,应在不同温度和频率条件下测量 Vf、Ir,以确保在最恶劣工况下仍满足系统要求。

六、可靠性与封装注意事项

  • SOT-23 封装利于自动化贴装与回流焊,但对焊接温度敏感,请遵循厂商给出的回流焊工艺曲线。
  • 长期高温或过载会加速老化,建议在设计初期引入适当的安全裕度。
  • 对于关键安全路径或高可靠性要求的应用,建议进行额外的老化与温度循环测试以验证寿命。

结语:基于上述规格,BAT54S(LGE 鲁光)是一款适合中低功耗、空间受限场合使用的通用串联二极管方案。合理的电气参数与小巧的 SOT-23 封装使其在便携设备、电源管理与信号保护等领域具有良好的实用性。设计时请结合实际工况和完整数据手册做详细热与电参数校核,以确保长期稳定运行。

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