Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LGE 1N4001
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LGE 1N4001
- Type
- LGE
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LGE
- Electronic Component
- 1N4001
- Electronic Component
- 1
- Package
- DO-41
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.255g
- Electronic Component
- 1
- Electronic Component
- BM0230873932
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 5uA@50V
- (Vf)
- 1V@1A
- Electronic Component
- 65℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1N4001 通用整流二极管（LGE / 鲁光，DO-41）
一、产品简介
1N4001 为通用整流二极管，LGE（鲁光）品牌，采用独立式（轴向）DO-41 封装，适用于低压直流整流与一般整流保护场合。器件设计目标是提供可靠、低成本的整流解决方案，工艺成熟、易于手工焊接与量产插装。
二、主要电气参数
- 直流反向耐压（Vr）：50V，适用于低压整流线路。
- 正向压降（Vf）：约1.0V @ 1A，在1A 工作点下具有典型的压降表现，有利于评估功耗与散热。
- 整流电流（Io）：1A（额定平均整流电流），适合小功率电源与通用整流。
- 反向电流（Ir）：典型值约5µA @ 50V，反向漏电小，有助于在反向偏置时减小损耗与热量产生。
三、封装与机械特性
DO-41 轴向引线封装，便于穿孔安装（PTH）与手工装配。封装耐用、机械强度高，适配传统变压器整流桥、面包板或小型功率模块。外形有利于散热，但在高功率或连续高电流应用中仍需考虑外加散热或降低额定电流使用寿命。
四、典型应用场景
- 低压整流电源（单相整流、半波/全波电路）。
- 逆向极性保护、二极管逻辑隔离。
- 充电器、适配器和小型家电的整流与保护电路。
- 工业与消费类电子中作为通用整流或钳位元件使用。
五、使用建议与注意事项
- 由于为通用整流二极管，恢复时间比快恢复或肖特基二极管长，不建议用于高频开关电源或高速脉冲应用。
- 在接近额定电流工作时，应评估正向压降低带来的功耗（P = Vf × I）和相应的温升，必要时降低电流或改善散热。
- 焊接与装配应遵循厂商推荐的温度与时间规范，避免长时间高温焊接损伤封装或内部接点。
- 在设计中考虑反向电压裕量，避免在高温或脉冲过电压条件下接近最大反向耐压。
六、可靠性与质量特性
LGE（鲁光）品牌的 1N4001 以工艺稳定、一致性好为特点，适合大批量生产应用。长期可靠性依赖于工作环境（温度、过载频率、浪涌）。在关键应用中建议参考厂商完整数据手册，进行必要的过载、温升与寿命试验验证。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
