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LGE SS545L(SMAF) SS545L
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LGE SS545L(SMAF)
- Type
- LGE
- Minimum package
- 3000 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LGE
- Electronic Component
- SS545L(SMAF)
- Electronic Component
- 1
- Package
- SMAF
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.054g
- Electronic Component
- 1
- Electronic Component
- BM0264826460
- Current
- 5A
- Diode
- Electronic Component
- Current(Ir)
- 500uA@45V
- (Vf)
- 450mV
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 45V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SS545L (SMAF) — LGE(鲁光) 45V/5A 表面贴装整流二极管产品概述
一、产品概览
SS545L（封装：SMAF）为鲁光（LGE）出品的独立式金属-硅结二极管，属多数载流子传导器件，适用于表面贴装工艺。该器件在低压、高频工作条件下具有低正向压降、低损耗及高浪涌能力，专为整流、续流与极性保护等场合设计。
二、主要电气参数
- 型号：SS545L（SMAF）
- 正向压降（Vf）：典型 0.45 V（注：典型值随电流变化，规格书为准）
- 直流反向耐压（Vr）：45 V
- 额定整流电流：5 A（连续）
- 反向漏电流（Ir）：最大 500 μA @ 45 V
- 封装形式：SMAF（表面贴装，适合自动贴装与回流焊工艺）
- 特性：金属-硅结（肖特基类行为），多数载流子导通，低压降、快速恢复/无恢复延迟
三、关键特性与优势
- 低正向压降：降低导通损耗，提高整机效率，适合对效率和热管理敏感的电源及功率模块。
- 高整流能力与强浪涌承受力：满足高峰值电流场景（如瞬态冲击、启动电流）。
- 低漏电流：在高反向电压下保持较低反向电流，适合开关电源与逆变器回路，减少空载损耗。
- 表面贴装封装：适配SMT生产线，便于小型化设计与可靠焊接。
四、典型应用场景
- 低压、高频开关电源（SMPS）输出整流与同步整流辅助。
- 逆变器与电机驱动的续流二极管（freewheeling）。
- 电源极性保护与反接保护电路。
- 汽车电子（需核对车规温度/湿度要求）与工业电源模块的整流与保护。
五、封装与PCB布板建议
- SMAF 封装具有一定的散热面积，但仍建议在器件引脚附近设置宽铜地/电源平面以增强散热。
- 对于5A电流水平，建议在器件下方与周围放置热过孔或连接到底层大面积铜箔以降低结温。
- 采用标淮回流焊工艺，建议遵循 J-STD-020 的回流曲线（峰值温度和时间参考器件规格书）。
- 焊盘尺寸和丝印参照厂方推荐封装图，以保证良好焊点与机械强度。
六、使用注意与可靠性建议
- 在实际设计中，应注意结温随封装散热条件和工作电流上升，进行适当的热仿真与余量设计。
- 反向耐压为45V，设计时应保留足够的安全裕度以防浪涌电压超出器件极限。
- 长期在高温或高湿环境下使用时，请参照完整规格书的寿命与环境耐受性数据进行验证。
- 储存与贴装前避免受潮吸湿，必要时采用干燥箱或烘烤处理以防焊接缺陷。
七、选型与采购提示
- 型号标识：SS545L — SMAF — LGE（鲁光）品牌。
- 在替换同类器件时，应对比正向压降、漏电流、反向耐压、额定电流及封装热阻等关键参数。
- 推荐在量产前获取并评估厂方完整数据手册（Datasheet）与可靠性报告，必要时申请样品做温升和寿命测试。
如需该型号的完整电气特性曲线、封装尺寸图或回流焊建议曲线，可提供以便进一步确认设计细节与可靠性验证。
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