WMSIC Electronic Components

Leiditech BTRD04A035

ModelBTRD04A035
PackageDFN1006
BrandLeiditech
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Leiditech BTRD04A035
Type
LEIDITECH
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LEIDITECH
Electronic Component
BTRD04A035
Electronic Component
1
Package
DFN1006
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Cj- Capacitor
0.22pF
Electronic Component
BM0229921451
Operating Temperature
55℃~+150℃
Voltage
23V
Electronic Component
IEC 61000-4-5
Current(Ir)
500nA
Voltage(VBR)
6V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BTRD04A035 产品概述

一、产品简介

BTRD04A035 是 Leiditech(雷卯电子)推出的一款低容、高能量的瞬态电压抑制保护器件,采用紧凑型 DFN1006 封装,专为保护敏感电子接口免受雷击、浪涌和静电放电等瞬态过压侵害而设计。器件在 5V 工作系统中具备良好的钳位能力和能量吸收能力,满足 IEC 61000-4-5 浪涌防护等级要求。

二、主要电气参数

  • 反向截止电压 Vrwm:5 V(适配常见 5V 总线与接口)
  • 击穿电压(典型):6 V
  • 钳位电压 Vc:約 23 V(在 8/20 μs 浪涌脉冲条件下)
  • 峰值脉冲功率 Ppp:110 W(8/20 μs)
  • 反向电流 Ir:500 nA(常温下低泄漏)
  • 结电容 Cj:0.22 pF(极低电容,适合高频/高速信号)
  • 工作温度范围:-55 ℃ 至 +150 ℃
  • 安全/标准:符合 IEC 61000-4-5 浪涌防护规范

三、典型应用场景

  • USB、HDMI、DisplayPort 等高速数据接口的端口保护
  • 串行总线(如 UART、I2C、SPI)及差分信号线路的浪涌/ESD 防护
  • 工业与通讯设备的接口保护(控制板、网关、传感器节点)
  • 电源侧和信号侧的瞬态抑制,适配 5V 电源总线的浪涌抑制需求
  • 需要保持信号完整性的高速链路场景(低结电容优势明显)

四、封装与可靠性

BTRD04A035 采用 DFN1006 小型贴片封装,适合表面贴装工艺(SMT),占板面积小,厚度低,便于高密度设计集成。器件额定工作温度宽,适用于工业级环境;在符合制造工艺的前提下,可稳定承受多次脉冲冲击(需按应用评估重复脉冲能量与器件寿命)。

五、产品优势

  • 低电容(0.22 pF):对高速信号干扰小,保持信号完整性,适用于差分与单端高速接口。
  • 高脉冲功率(110 W):能有效吸收 8/20 μs 浪涌能量,降低后端电路受损风险。
  • 低泄漏电流(500 nA):对电源与低功耗电路影响小,有利于节能设计。
  • 宽温度范围与工业级防护标准(IEC 61000-4-5):适配复杂环境与工业应用。

六、PCB 布局与使用建议

  • 将器件尽量靠近受保护的连接器或信号入口放置,缩短信号或电源到浪涌源的走线长度,以降低寄生感抗。
  • 对地连接应采用短而粗的回流路径,避免长回流走线产生较大电感。必要时在器件附近设置多个接地过孔以改善散热与接地回路。
  • 在多通道保护场景,注意通道间隔与接地共享策略,避免互相耦合导致钳位性能下降。
  • 贴片焊接按照制造商推荐的回流曲线进行,DFN 封装需注意湿度控制与焊接热力学要求以防焊接缺陷。
  • 评估应用中可能的重复脉冲能量与频率,对可能的过载情况做热与寿命仿真与测试。

七、选型与注意事项

  • 确认系统工作电压与 Vrwm(5V)匹配,若系统存在高于 5V 的常态工作电压,应选择相应额定 Vrwm 的款型。
  • 钳位电压约 23V,在保护后端器件时仍需确认该钳位水平不会超过后续电路的耐压极限。
  • 对于多次高能脉冲或更苛刻的浪涌等级,应基于实际能量计算是否需要并联或级联保护元件。
  • 在高可靠性或汽车级应用中,应结合具体测试数据与可靠性规范进一步验证(如需汽车 AEC 认证应额外确认规格)。

总结:BTRD04A035 凭借低结电容、较高脉冲功率和工业级温度/防护性能,是面向 5V 系统与高速接口的有效瞬态保护选择。在实际设计中,合理的 PCB 布局与对钳位电压、重复脉冲能量的评估,能进一步提升系统的可靠性与稳定性。若需完整数据手册或封装尺寸图,请联系 Leiditech 或查阅官方资料以获得详细参数与应用参考。

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