WMSIC Electronic Components

LUTE 0805L010/33AR 0805L010

Model0805L010/33AR
Package0805
BrandLUTE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LUTE 0805L010 / 33AR
Type
LUTE
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LUTE
Electronic Component
0805L010/33AR
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.031g
Electronic Component
2.3mm
Electronic Component
1.2mm
Electronic Component
1
Electronic Component
1.5s
Electronic Component
BM0264548597
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
33V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805L010/33AR 产品概述

一、产品简介

0805L010/33AR 是陆特(LUTE)推出的一款微型自恢复过流保护元件,采用0805封装,体积小、重量轻,特别适合空间受限的工业级传感器及工控端子等场合做一路输入或子模块的过流/过温自保护。器件在过流时可快速升阻限制电流,故障消除后自动恢复,支持多次动作且焊接与动作后电阻变化率极小,便于长期稳定使用。

二、主要技术参数

  • 品牌/型号:LUTE 陆特 / 0805L010/33AR
  • 耐压(Vmax):33 V
  • 最大承受电流(Imax,短时冲击能力):40 A
  • 保持电流(Ihold):100 mA(典型/测试条件下)
  • 跳闸电流(Itrp):300 mA(典型/测试条件下)
  • 功率耗散(Pd):500 mW(在规定环境温度下)
  • 初始态阻值(Rmin):750 mΩ
  • 跳断后阻值(R1max):6 Ω(跳闸状态)
  • 动作时间:约 1.5 s(在指定触发电流下的典型动作时间)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 外形尺寸(典型):长 2.3 mm × 宽 1.5 mm × 高 1.2 mm(0805 封装)

三、核心特性

  • 超小占板面积:标准0805封装,适配常见贴片工艺与自动化装配。
  • 低初始电阻与低压降:Rmin ≈ 750 mΩ,正常工作时对信号与电源干扰小,适合低压小电流电路。
  • 快速自恢复保护:遇过流时阻值快速上升(可达数Ω),显著限制通过电流,故障消除后自动恢复,便于维护。
  • 高冲击承受力:短时最大冲击电流可达 40 A,能承受突发浪涌或短路脉冲。
  • 稳定性好:多次过流动作与多次回流焊接后阻值变化小,符合工业级长期可靠性要求。

四、典型应用场景

  • 工业级传感器供电线路过流保护(温度传感、压力传感、流量传感等)
  • 工控终端、采集模块的输入防护及热保护回路
  • 通讯模块、小功率驱动及接口电源保护(低压直流系统,Vmax ≤ 33V)
  • 电池监测、USB 或小功率总线保护(需注意电压与电流匹配)

五、安装与使用建议

  • 建议串联放置于被保护回路的输入端,尽量靠近被保护器件或端子以缩短保护路径。
  • 焊接工艺兼容常规回流焊(请按锡膏和PCB厂商建议控制温度曲线),器件对多次回流敏感度低,但仍建议避免超过推荐的热负荷。
  • 在高温环境或高功率耗散场景下,注意器件热管理与周围散热条件,避免长期处于接近 Pd 的工作点。
  • 选型时以实际工作电流、短路容限与触发要求为准,保留安全裕量;Vmax 33V,不建议用于高于额定电压的场合。

六、可靠性与测试说明

  • 器件通过多次动作与回流焊后阻值变化率小,适合需要长期反复自恢复保护的工业应用。
  • 建议在设计验证阶段做实际应用的老化与过流循环测试,确认在目标环境温度与外部电路下的触发特性与恢复行为。
  • 对于关键安全回路,建议与其他保护手段(如熔断器、限流电路)配合使用,构建多层次的保护策略。

如果需进一步的典型特性曲线、封装尺寸图或样品与量产报价,可提供具体应用电压/电流与电路拓扑,我方可针对性给出参考方案与选型建议。

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