WMSIC Electronic Components

LX AD8551(LX) AD8551

ModelAD8551(LX)
PackageSOT-23-5
BrandLX
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LX AD8551(LX)
Type
SOT-23-5
Minimum package
3000 卷

Technical parameters

Electronic Component
LX
Electronic Component
AD8551(LX)
Electronic Component
1
Package
SOT-23-5
Electronic Component
Precision Op Amp
Electronic Component
0.047g
Electronic Component
1
Electronic Component
Output
Features
Electronic Component
Electronic Component
BM0264498260
Operating Temperature
40℃~+125℃
Output Current
50mA
(SR)
2.3V/us
Power Supply Voltage
2.4V~5.5V
Static Current(Iq)
450uA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AD8551(LX) 精密零漂运放(SOT-23-5)产品概述

一、产品简介

AD8551(LX) 为灵星芯微(LX)推出的一款低失调、零漂移(自动稳零)精密运算放大器,封装为 SOT-23-5,适合空间受限且要求高精度和低温漂的便携式与工业测量应用。器件支持轨到轨输入与输出,单电源工作电压范围宽(2.4V 至 5.5V),兼顾低功耗与较强驱动能力。

二、主要特性

  • 单电源电压:2.4 V ~ 5.5 V
  • 输入失调电压 Vos:1 µV(典型)
  • 输入失调电压温漂 Vos TC:8 nV/℃
  • 增益带宽积 GBW:3.5 MHz
  • 轨到轨输入与轨到轨输出,适合满量程信号采集
  • 压摆率 SR:2.3 V/µs
  • 共模抑制比 CMRR:120 dB
  • 输入电压噪声密度 eN:15 nV/√Hz @ 1 kHz
  • 输入偏置电流 Ib:400 pA;输入失调电流 Ios:200 pA
  • 静态电流 Iq:450 µA(静态功耗低,适合电池供电)
  • 输出驱动能力:可驱动至 50 mA 峰值
  • 工作温度范围:-40 ℃ ~ +125 ℃
  • 功能特性:零漂移 / 自动稳零,长期稳定性佳

三、典型应用

  • 精密传感器信号调理(热电阻、霍尔、桥式传感器)
  • 低速精密 ADC 驱动与前置放大器
  • 工业数据采集与过程控制系统
  • 医疗仪表与便携检测设备(对温漂与低噪声有严格要求的场合)
  • 电池供电与便携式仪器的缓冲与放大电路

四、使用与布局建议

  • 电源去耦:靠近 VCC 与 GND 引脚各放置 0.1 µF 陶瓷电容,并考虑 1 µF~10 µF 的旁路,优化低频与瞬态响应。
  • 输入保护:若输入可能有大电压或反向电压,建议加入限流电阻或 TVS/钳位二极管保护。
  • 负载与稳定性:器件为轨到轨输出且可驱动较大电流,但在驱动容性负载时可能需要串联输出电阻以保证稳定。
  • 包装与热管理:SOT-23-5 封装散热受限,长期靠近额定输出电流工作时注意布局散热与铜箔面积。
  • PCB 布局:信号回路短且直接,模拟地与电源地分区并在单点汇流,敏感输入远离开关噪声源。
  • 零漂特性:器件采用自动稳零技术,长期漂移小;在对瞬态噪声极其敏感的场合,建议评估 chop/auto-zero 相关的微小干扰并采用滤波或采样抑制法。

五、封装与可靠性

  • 品牌:LX(灵星芯微)
  • 封装:SOT-23-5,适合空间受限应用与自动贴装生产工艺
  • 环境适应:工作温度范围宽(-40 ℃ ~ +125 ℃),适合工业级应用
  • 建议在可靠性设计中考虑 ESD 保护与焊接热循环对 SOT-23-5 的影响,按制造商的封装与焊接指南进行工艺控制。

总结:AD8551(LX) 以其 1 µV 级别的超低失调、极低温漂与零漂移稳定性,加上轨到轨输入/输出与宽电源范围,是低频高精度测量与便携仪表的优选放大器。在实际设计中结合良好的电源去耦、合适的输入保护与 PCB 布局,可充分发挥器件的精度与稳定性。若需参考电路或更多参数(如启动特性、失真、PSRR 等),建议索取完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.