WMSIC Electronic Components

lelon VZH331M1ETR-0810 VZH331M1ETR

ModelVZH331M1ETR-0810
PackageSMD,8x10mm
Brandlelon
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
lelon VZH331M1ETR-0810
Type
LELON
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LELON
Electronic Component
VZH331M1ETR-0810
Electronic Component
1
Electronic Component
330uF
Package
SMD,8x10mm
Electronic Component
SMD Aluminum Electrolytic Capacitor
Electronic Component
±20%
Electronic Component
1.234g
Electronic Component
1
Electronic Component
BM0264519936
Electronic Component
5000hrs@105℃
Operating Temperature
45℃~+105℃
Voltage
25V
Capacitor
8mm
Capacitor
10mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

VZH331M1ETR-0810 贴片铝电解电容产品概述

一、基本属性与核心规格参数

VZH331M1ETR-0810是台湾立隆(lelom)推出的通用型贴片铝电解电容,针对低压直流电路的滤波、储能需求设计,核心参数清晰明确:

  • 标称容值:330μF(型号中“331”对应“33×10¹μF”的铝电解电容编码规则);
  • 容值精度:±20%,满足大多数通用电路对容值偏差的要求;
  • 额定电压:25VDC,适用于低压直流供电系统(实际应用建议降额至20V以内,提升可靠性);
  • 工作温度范围:-45℃~+105℃,覆盖极端环境;
  • 工作寿命:5000hrs@105℃,高温工况下的可靠性指标。

这些参数平衡了性能与成本,适合中低端至中端电子设备的批量应用。

二、封装与物理特性

该电容采用SMD贴片封装,电容体尺寸为8mm(直径)×10mm(长度),对应行业标准“3533”封装标识(部分厂商以尺寸编码),具备以下优势:

  1. 自动化兼容:适配表面贴装(SMT)工艺,提升生产效率,降低人工成本;
  2. 空间节省:相比插件式电容,减少PCB板占用面积,适配高密度电路设计;
  3. 尺寸紧凑:8×10mm的封装适合小型化设备(如便携式音响、小型通信模块)。

需注意:引脚间距约2.5mm,焊接时需确认PCB焊盘与引脚匹配(可参考立隆官方datasheet)。

三、电气性能与可靠性分析

3.1 电气性能表现

  • 容值稳定性:在-45℃~+105℃范围内,容值偏差保持±20%以内;低温(-45℃)下容值略有下降(≤-10%),高温(105℃)下性能稳定;
  • 漏电流:符合铝电解电容常规标准(≤0.01CV μA,C=容值、V=额定电压),满足电源滤波的低损耗需求;
  • 阻抗特性:120Hz典型滤波频率下,等效串联电阻(ESR)处于合理区间,有效抑制电源纹波。

3.2 可靠性优势

  • 高温寿命:5000hrs@105℃是核心指标——电容在105℃环境下持续工作5000小时后,容值偏差仍≤±20%,漏电流未超初始值2倍,适配工业、车载高温场景;
  • 宽温适应性:-45℃低温启动性能,适合寒冷地区或低温设备(如户外监控、车载冬季启动);
  • 振动耐受:贴片引脚焊接强度较高,符合IEC 60068-2-6振动测试标准,适配移动设备或工业现场环境。

四、典型应用场景

结合参数特性,该电容主要应用于:

  1. 消费电子:电视、音响、机顶盒的电源滤波电路(低压直流供电,需中等容值储能);
  2. 工业控制:PLC、变频器的辅助电源模块(宽温需求,高温可靠性);
  3. 车载电子:车载音响、仪表盘、行车记录仪的低压电路(-45℃~+105℃适配车载环境);
  4. 通信设备:小型基站、路由器的电源模块(贴片封装节省空间,满足高密度设计);
  5. 便携式设备:移动电源、蓝牙音箱的储能电路(尺寸紧凑,适配小型化需求)。

五、品牌与质量保障

该产品由台湾立隆(lelom) 生产,立隆是全球知名铝电解电容制造商,拥有30+年研发生产经验,产品覆盖通用型、高频低阻型、长寿命型等系列,广泛应用于电子、汽车、工业领域。

质量保障方面:

  • 符合RoHS、REACH环保标准,无有害物质;
  • 通过ISO 9001质量管理体系认证,产品一致性高;
  • 批量供应稳定,适合OEM/ODM厂商大规模生产需求。

总结

VZH331M1ETR-0810贴片铝电解电容以宽温范围、高可靠性、紧凑封装为核心优势,适配多种低压直流电路应用,是平衡性能与成本的理想选择,尤其适合对温度、空间有要求的工业、车载及消费电子场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.