Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM188R61A106ME69D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM188R61A106ME69D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM188R61A106ME69D
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0000282762
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：GRM188R61A106ME69D
概要
GRM188R61A106ME69D 是一款由知名电子元器件制造商村田（muRata）生产的多层陶瓷电容器（MLCC）。其设计旨在满足现代电子设备对高性能、高可靠性部署的需求，广泛应用于消费类电子、计算机、通信设备及工业应用中。
关键参数
- 电容值: 10µF
- 额定电压: 10V
- 容差: ±20%
- 工作温度范围: -55°C 至 +85°C
- 材料类型: X5R（适应温度变化的电介质材料）
- 封装类型: 0603 (1608 公制)
- 尺寸: 1.60mm x 0.80mm x 0.90mm（长 x 宽 x 高）
电气特性
GRM188R61A106ME69D 的电容特性使其成为适用于各种电子电路的理想选择。电容值为10µF，能够有效地在电路中平滑电源，降低电源噪声，并提高电源的稳定性。其额定电压为10V，确保在标准工作环境中可靠运行。随着电子设备对高性能与低功耗的要求日益增加，该电容通过高达±20%的容差设置，提供了相对灵活的电容值选择，使用户能够根据实际应用需求来设计电路。
温度和温漂特性
GRM188R61A106ME69D 采用的 X5R 材料具有优良的温度特性。在-55°C 到 +85°C 的宽广温度范围内，该电容可以保持相对稳定的电容值，具有较小的温度漂移，能有效应对温度变化对电容性能的影响，确保设备在不同温度下依然保持正常工作。
封装与安装
该电子元器件采用0603（1608公制）封装，尺寸极小，有效节省了电路板的空间，适合当前高度集成的小型电子设备需求。表面贴装技术（SMT）使得该电容在现代自动化生产中易于安装，进一步提升了生产效率和可靠性。这种安装方式在保证电气性能的同时，还减少了由于线路连接引起的潜在故障。
应用场景
GRM188R61A106ME69D 的广泛应用领域包括：
- 消费电子: 用于智能手机、平板电脑、电视和其他消费类电子设备，作电源去耦和滤波元件。
- 计算机与通信设备: 用于主板、电源管理和信号调理电路，提升系统的稳定性和可靠性。
- 工业控制: 强大的耐环境性能使其适合用于工业自动化设备和仪器仪表中。
- 汽车电子: 在汽车电子系统中，如车载导航和电源管理单元，帮助提升整体的电源效率和功能可靠性。
结论
综合以上特点，GRM188R61A106ME69D 是一款性能优越、适应性强的电容器。它的多用途设计、优良的电气特性以及高温适应性使它在现代电子产品的各种应用场景中显示出其重要价值。无论是在消费电子还是工业应用中，这款电容都是确保电源质量与系统稳定性的可靠选择，是设计人员和工程师值得信赖的元件之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
