WMSIC Electronic Components

muRata GRM1555C1H101JA01D

muRata GRM1555C1H101JA01D
1 / 3

Product image

ModelGRM1555C1H101JA01D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Send RFQ Contact customer service

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM1555C1H101JA01D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM1555C1H101JA01D
Electronic Component
1
Electronic Component
100pF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0000287876
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述：GRM1555C1H101JA01D

产品名称：GRM1555C1H101JA01D

类型：多层陶瓷电容（MLCC）

品牌：村田 (muRata)

1. 引言

GRM1555C1H101JA01D是一款由村田公司生产的高精度表面贴装电容器，广泛应用于现代电子设备中。作为一种多层陶瓷电容(MLCC)，它结合了小型化、高稳定性和优越的电性能，特别适合对体积和性能有严格要求的应用场景。

2. 基本参数

  • 额定电压：50V
  • 电容值：100pF
  • 容差：±5%
  • 温度系数：C0G/NP0
  • 工作温度范围：-55°C ~ 125°C

3. 特性与优势

  • 高精度：GRM1555C1H101JA01D的精度达到±5%，使其在需要严格控制电容值的应用中表现优异。特别是在模拟电路和高频电路中，稳定的电容特性能有效降低失真和噪音。

  • 温度稳定性：选用C0G介质材料，玻璃陶瓷的特性使得电容器在整个工作温度范围内保持良好的电性能，其电容值对温度的变化非常稳定，适合在高温或极低温的环境下使用。

  • 小型化设计：采用0402封装（1005公制），其尺寸为1.00mm x 0.50mm，厚度为0.55mm。极小的体积使得GRM1555C1H101JA01D非常适合空间有限的电子产品，如手机、笔记本电脑和高密度电路板。

  • 电压适用性：可承受高达50V的电压，尤其适合需要高电压稳定性的电路设计。

4. 应用场景

GRM1555C1H101JA01D的广泛应用领域包括但不限于：

  • 消费电子：智能手机、平板电脑、各类便携式音频设备等对高频和低噪音要求高的消费类电子产品。

  • 工业设备：在各种工业控制电路、传感器和监测设备中，稳定性和可靠性至关重要，表面贴装电容可以可靠地支撑这些应用。

  • 通信设备：在射频、混合信号电路中，GRM1555C1H101JA01D可以作为耦合和去耦电容使用，确保信号的完整性。

  • 汽车电子：随着汽车电子系统的越来越复杂，该电容在车辆控制单元（ECU）、传感器以及其他自动驾驶相关设备中也得到了应用。

5. 结论

GRM1555C1H101JA01D是一款在多种应用中表现卓越的表面贴装陶瓷电容器，凭借其高精度、高温稳定性和小型化设计，已经成为电子产品设计工程师的首选元器件之一。无论是在消费电子、工业设备还是汽车电子领域，这款电容器都能满足高标准的性能要求，助力未来电子产品的发展。

对于设计师来说，选择GRM1555C1H101JA01D意味着将获得卓越的可靠性、性能和应用灵活性，是实现高效能电路设计的重要保障。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.