WMSIC Electronic Components

muRata GRM033R61C104KE18D

ModelGRM033R61C104KE18D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM033R61C104KE18D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM033R61C104KE18D
Electronic Component
1
Electronic Component
100nF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM0257268633
Electronic Component
X5R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM033R61C104KE18D 产品概述

概要

GRM033R61C104KE18D 是由日本知名电子元器件制造商 Murata Electronics 生产的一款贴片电容(MLCC),属于其广泛的多层陶瓷电容器产品系列。以下是对此产品的详细介绍。

基本参数

  • 制造商: Murata Electronics
  • 包装: 卷带(TR)
  • 零件状态: 有源
  • 基本产品编号: GRM033R61C
  • 描述: 贴片电容(MLCC)16V ±10% 100nF X5R 0201

详细参数

  • 电压等级: 16V
    • 这意味着该电容器在正常工作条件下可以承受的最大直流电压为16伏特。
  • 容量: 100nF (0.1μF)
    • 容量为100纳法拉,适用于各种需要中等容量的应用场景。
  • 容差: ±10%
    • 表示实际容量可能在100nF的±10%范围内浮动,这是工业标准的一部分。
  • 温度特性: X5R
    • X5R 是一种常见的温度特性分类,表示在-55°C到+85°C的温度范围内,电容值不会超过原始值的±15%。这种特性使得该电容器在广泛的温度条件下保持稳定性能。
  • 封装尺寸: 0201
    • 封装尺寸为0201,表示长度为0.02英寸(0.5mm),宽度为0.01英寸(0.25mm)。这种小尺寸使得它非常适合现代电子设备中的紧凑设计。

品牌和制造商

  • 品牌: muRata(村田)
    • Murata Electronics 是全球领先的电子元器件制造商,特别在多层陶瓷电容器(MLCC)领域具有丰富经验和技术优势。

应用场景

GRM033R61C104KE18D 因其小尺寸、稳定性能和广泛适用性,常见应用包括:

  • 移动设备
    • 智能手机、平板电脑、可穿戴设备等移动电子产品中,需要小型化和高可靠性的电容器。
  • 汽车电子
    • 汽车系统中的各种电子控制单元,需要在严苛环境下保持稳定运行的电容器。
  • 工业控制
    • 工业自动化设备、机器人控制系统等,要求高可靠性和耐久性的电容器。
  • 医疗设备
    • 医疗器械中的电子系统,需要小型化且高精度的电容器。

技术优势

  • 小尺寸
    • 0201 封装尺寸使得它非常适合现代电子设备中的紧凑设计,提高了 PCB 布局的灵活性。
  • 高稳定性
    • X5R 温度特性保证了在广泛温度范围内保持稳定的电容值,这对于许多应用场景是至关重要的。
  • 高可靠性
    • Murata Electronics 的严格质量控制和生产工艺确保了该产品的高可靠性和长寿命。

使用注意事项

  • 安装
    • 由于0201 封装尺寸非常小,需要使用精密的贴片机进行安装,以避免人为错误。
  • 焊接
    • 应遵循推荐的焊接参数,以确保良好的接触性和避免损坏元件。
  • 环境条件
    • 在设计时应考虑实际工作环境中的温度、湿度等因素,以确保元件在正常条件下运行。

总结

GRM033R61C104KE18D 是一款性能优异、适用范围广泛的小型贴片电容。其稳定性、可靠性和紧凑设计使其成为现代电子产品设计中的理想选择。通过选择此产品,工程师可以确保他们的设计满足严格的性能要求,同时实现空间效率最大化。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.