WMSIC Electronic Components

muRata GRM155R70J105KA12D

ModelGRM155R70J105KA12D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM155R70J105KA12D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM155R70J105KA12D
Electronic Component
1
Electronic Component
1uF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0000281165
Electronic Component
X7R
Voltage
6.3V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GRM155R70J105KA12D

一、基本信息

产品名称: GRM155R70J105KA12D
品牌: muRata(村田)
类型: 贴片电容(多层陶瓷电容,MLCC)
封装类型: 0402(1005公制)
电容值: 1μF
额定电压: 6.3V
容差: ±10%
温度系数: X7R
工作温度范围: -55°C至125°C
尺寸: 0.039"长 x 0.020"宽 (1.00mm x 0.50mm)
厚度(最大值): 0.022" (0.55mm)
应用领域: 通用电子产品

二、产品特点

GRM155R70J105KA12D 是一种符合最新工业标准的多层陶瓷电容器,专门设计用于高性能电子设备。其卓越的精度和稳定性,使其在各类应用中表现出色,尤其是在温度变化较大的环境下。

  1. 精度与稳定性:该电容器的容差规格为±10%,确保用户在多种电子电路中能够获得一致的性能。温度系数为X7R,适用于较宽的工作温度范围,能够提供良好的温度稳定性和可靠性。

  2. 尺寸与封装:0402封装(1005公制)使其适合于日益紧凑的小型电子设备中。小巧的尺寸有助于提高电路板的空间利用率,为高密度电路提供便利。

  3. 广泛的应用场景:由于其通用性,GRM155R70J105KA12D适用于多种电子设备,包括智能手机、平板电脑、笔记本电脑及各类便携式音响设备等。其可靠性也使其可在汽车电子、工业控制及医疗设备等领域发挥重要作用。

三、性能优势

  • 高介电强度:X7R材质赋予了该电容器较高的介电强度,能够在额定电压下安全稳定地工作,有效降低击穿风险。
  • 优异的温度特性:广泛的工作温度范围(-55°C ~ 125°C)确保其在极端条件下依然保持性能,对终端产品的工作稳定性至关重要。
  • 小型化设计:0402的封装设计使其能够解决现代电子产品对空间的高要求,方便设计师进行布局优化。

四、应用实例

在当今的电子产品设计中,GRM155R70J105KA12D以其优异的性能和尺寸,广泛应用于多种领域:

  • 消费电子:在智能手机和便携式设备中,用于滤波、去耦及信号耦合,确保电路稳定性。
  • 汽车电子:在汽车控制系统中提供正常运行的去耦和滤波功能,保证通信的可靠性。
  • 工业设备:作为控制电路中的去耦电容,优化信号传输,提高抗干扰能力。
  • 医疗设备:在医疗监测和诊断仪器中,保证电路的高度可靠性和稳定性,确保设备的正常运行。

五、总结

GRM155R70J105KA12D 多层陶瓷电容器以其高品质、可靠性和广泛的应用适用性,成为工程师在设计电路时的一种理想选择。凭借其卓越的规格和性能,muRata(村田)的这一产品在众多领域中均展现出极大价值,助力电子产品的升级和创新。如果您正在寻找一种高效且稳定的电容器,GRM155R70J105KA12D无疑值得考虑。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.