Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品名称: GRM1555C1H3R3BA01D
品牌: muRata(村田)
类型: 贴片电容(MLCC,Multi-Layer Ceramic Capacitor)
封装: 0402
GRM1555C1H3R3BA01D 是一款高品质的多层陶瓷电容,具有3.3皮法(pF)的电容值,额定电压为50V。其容差为±0.1pF,确保在电路中的稳定性和性能。该器件的温度系数为C0G(NP0),是专为需要高精度和高稳定性的应用而设计的。
该电容器适用于多个应用领域,包括:
射频(RF)电路:由于其低电容值和高额定电压,GRM1555C1H3R3BA01D 非常适合Broadband RF应用,这使得它能够在高频下稳定工作,减少信号干扰。
信号处理:在数据采集和信号处理电路中,低电容值的电容器可用于滤波和耦合,以维持信号完整性。
精密电路:由于其优越的温度稳定性,该电容器特别适合用于温度敏感的精准电路,如高端音频设备、测量仪器等。
高频设备:在无线通信和计算机设备中,能够在高频下工作的能力使其成为首选元件之一。
温度工作范围: -55°C 至 125°C,这种宽广的温度范围使得该产品在极端环境下依然能够稳定工作。
容差小: ±0.1pF的容差使得该电容器在电路设计中能够带来高度的可重复性和精确度,尤其在对电容量要求极为严格的应用中显得尤为重要。
体积小巧: 封装大小为0402(1005公制),尺寸为1.00mm x 0.50mm,厚度最大为0.55mm,适合高密度的电路板设计,使得其在空间有限的情况下也能发挥作用。
GRM1555C1H3R3BA01D 与传统电容器(如电解电容或铁氧体电容)相比,具有更高的电压承受能力和更低的漏电流,适合在更高频率和更高电压环境下使用。这种性能使得它在现代电子设备中具备不可或缺的地位。
此电容器为表面贴装(SMD/SMT),易于在自动化生产中快速装配,降低了生产成本和工艺复杂度。同时,其0402的封装也与各种主流电路板设计兼容,能够满足不同厂商对电路板设计标准化的要求。
总体而言,GRM1555C1H3R3BA01D 作为 muRata 提供的一款高性能多层陶瓷电容,凭借其小巧的体积、卓越的稳定性及广泛的应用领域,使其成为电子设计师在多种高端电子产品中的首选。无论是用于高频射频电路,还是在精密信号处理的应用场景中,该电容器都能有效促进设备性能的提升,确保电路的长时间可靠运行。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products