WMSIC Electronic Components

muRata GRM155R61A475KEAAD

ModelGRM155R61A475KEAAD
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM155R61A475KEAAD
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM155R61A475KEAAD
Electronic Component
1
Electronic Component
4.7uF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0000000081
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GRM155R61A475KEAAD

概述

GRM155R61A475KEAAD 是由村田(muRata)生产的一款表面贴装多层陶瓷电容器 (MLCC)。该元件专为高性能电子电路设计而制造,具有良好的电气性能和可靠性。其主要规格为10V,容量为4.7μF,使用的介质类型为 X5R,这使得其在各种应用场景中表现出色。

规格参数

  • 品牌: 村田 (muRata)
  • 封装: 0402(0.04 × 0.02 英寸或 1.0 × 0.5 毫米)
  • 电压等级: 10V
  • 容量: 4.7μF
  • 公差: ±10%
  • 介质类型: X5R
  • 操作温度范围: -55°C 至 +85°C

介质类型 - X5R

X5R 是一种陶瓷电容器介质的分类,具有以下特性:

  • 温度特性: 在-55°C 至 +85°C 范围内,电容量的变化较小,通常不超过 ±15%。
  • 电压特性: 在额定电压下,电容量保持相对稳定,适合各种电气应用。
  • 介电常数: X5R 介质能够提供较高的电容量密度,使得在小尺寸(0402)的封装中实现较大的电容量,便于小型化设计。

应用场景

GRM155R61A475KEAAD 作为一款多层陶瓷电容器,可以广泛应用于许多电子组件和电路中。其主要用途包括:

  1. 滤波器: 在电源和信号线中用于去除高频噪声,改善电路的稳定性和性能。
  2. 耦合和去耦: 在模拟和数字电路中用于耦合信号和去耦电源,降低干扰。
  3. 时钟电路: 在时钟电路中作为平滑电容,提供稳定的电压。
  4. 电源管理: 在DC-DC 转换器和线性稳压器中用于平滑输出,提高转换器效率。

性能优势

GRM155R61A475KEAAD 具有众多优点,使其在现代电子产品中备受欢迎:

  • 小尺寸与轻量化: 0402 封装使其可以在空间有限的设计中使用,适合便携式设备。
  • 优越的电气性能: 具有较高的电容量密度,能在高频应用中保持稳定性能。
  • 可靠性高: 村田的制造工艺保证了极高的生产一致性和长期可靠性。
  • 宽广的温度范围: 适用于各种温度和环境条件,满足不同领域的需求。

安装与使用

GRM155R61A475KEAAD 的安装方式为表面贴装,适用于现代贴片技术,便于与其他电子元器件集成。用户在使用时须注意以下几点:

  • 确保电路板设计符合元件的封装要求,避免焊接应力带来的损伤。
  • 在电路设计中注意电容器的额定电压,确保在使用环境中不会超过10V。
  • 考虑到X5R材料的温度特性,在极端温度环境下检测电容器的性能变化。

结论

GRM155R61A475KEAAD 是一款功能强大的多层陶瓷电容器,凭借其紧凑的0402封装和优越的规格,广泛应用于高频电路、信号耦合、去耦及电源管理等场合。村田的技术和质量保证让其在市场上有着良好的口碑和用户群体,是现代电子设备设计中不可或缺的关键元件之一。对于要求高性能和高可靠性的电路设计工程师而言,选择 GRM155R61A475KEAAD 无疑是一个明智的决策。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.