Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM31CC72A475KE11L 是一种高性能的多层陶瓷电容器(MLCC),具有4.7µF的电容值,额定电压为100V,容差为±10%。它采用表面贴装技术(SMT)设计,封装尺寸为1206(3216公制),能够满足现代电子设备在空间和性能上的严苛要求。该电容器的工作温度范围为-55°C到125°C,适用于多种应用场景。
GRM31CC72A475KE11L 采用了村田公司领先的制造工艺,具备优良的温度稳定性和容量保持性能,尤其是在高温和低温环境下都能保持稳定。其X7S温度特性意味着在-55°C到+125°C的温度范围内,电容值变化不超过±15%,使其在高温和低温应用中的适用性非常广泛。
由于其较高的额定电压和可靠性,GRM31CC72A475KE11L适用于电源管理、滤波、储能等多种电子电路,特别是在涉及高频和高效率的应用领域。它广泛用于消费电子、汽车电子、工业控制、通信设备等多个行业。
作为一种表面贴装电容器,GRM31CC72A475KE11L的1206封装使其在电路板上的占用面积较小,有利于设计更加紧凑的电子设备。同时,其较小的厚度(最大1.90mm)也提升了设备的整体设计美观度,满足对轻薄化的市场要求。
GRM31CC72A475KE11L是一款集高性能、小型化与多用途优势于一身的电子元器件,能够满足当前市场上对可靠性和性能的双重需求。随着现代科技不断发展,对电子元器件的要求也日益提高,GRM31CC72A475KE11L在多样化的应用及极端环境下表现出的高稳定性、可靠性,使其成为工程师和设计师理想的选择。无论是在新产品开发、功能扩展还是现有产品的性能优化中,GRM31CC72A475KE11L都能提供有力支持,为电子产品的创新与升级注入新的动力。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products