WMSIC Electronic Components

muRata GRM31CC72A475KE11L

ModelGRM31CC72A475KE11L
Package1206
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM31CC72A475KE11L
Type
MURATA
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM31CC72A475KE11L
Electronic Component
1
Electronic Component
4.7uF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0084332650
Electronic Component
X7S
Voltage
100V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM31CC72A475KE11L 产品概述

产品简介

GRM31CC72A475KE11L 是一种高性能的多层陶瓷电容器(MLCC),具有4.7µF的电容值,额定电压为100V,容差为±10%。它采用表面贴装技术(SMT)设计,封装尺寸为1206(3216公制),能够满足现代电子设备在空间和性能上的严苛要求。该电容器的工作温度范围为-55°C到125°C,适用于多种应用场景。

技术参数

  • 电容量: 4.7µF
  • 容差: ±10%
  • 额定电压: 100V
  • 温度特性: X7S
  • 工作温度范围: -55°C ~ 125°C
  • 封装类型: 表面贴装(MLCC)
  • 封装尺寸: 1206(3216公制)
  • 尺寸: 0.126" 长 x 0.063" 宽(3.20mm x 1.60mm)
  • 厚度(最大值): 0.075"(1.90mm)
  • 品牌: muRata(村田)

设计与应用

GRM31CC72A475KE11L 采用了村田公司领先的制造工艺,具备优良的温度稳定性和容量保持性能,尤其是在高温和低温环境下都能保持稳定。其X7S温度特性意味着在-55°C到+125°C的温度范围内,电容值变化不超过±15%,使其在高温和低温应用中的适用性非常广泛。

由于其较高的额定电压和可靠性,GRM31CC72A475KE11L适用于电源管理、滤波、储能等多种电子电路,特别是在涉及高频和高效率的应用领域。它广泛用于消费电子、汽车电子、工业控制、通信设备等多个行业。

物理特性

作为一种表面贴装电容器,GRM31CC72A475KE11L的1206封装使其在电路板上的占用面积较小,有利于设计更加紧凑的电子设备。同时,其较小的厚度(最大1.90mm)也提升了设备的整体设计美观度,满足对轻薄化的市场要求。

优势与特色

  1. 小型化设计: 1206封装适合紧凑型电路设计,节省PCB空间。
  2. 优越的温度特性: X7S温度系数优良,适应不同气候条件,保持稳定性能。
  3. 高可靠性: 经过严格的测试和筛选,具备优良的长期稳定性和耐用性,特别是在高温、潮湿环境下表现出色。
  4. 多用途应用: 不仅适用于消费电子,高端通信、汽车工业和工业控制等领域也有出色表现。

结论

GRM31CC72A475KE11L是一款集高性能、小型化与多用途优势于一身的电子元器件,能够满足当前市场上对可靠性和性能的双重需求。随着现代科技不断发展,对电子元器件的要求也日益提高,GRM31CC72A475KE11L在多样化的应用及极端环境下表现出的高稳定性、可靠性,使其成为工程师和设计师理想的选择。无论是在新产品开发、功能扩展还是现有产品的性能优化中,GRM31CC72A475KE11L都能提供有力支持,为电子产品的创新与升级注入新的动力。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.