WMSIC Electronic Components

muRata GRM188R60J476ME15D

ModelGRM188R60J476ME15D
Package0603
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM188R60J476ME15D
Type
MURATA
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM188R60J476ME15D
Electronic Component
1
Electronic Component
47uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0010083095
Electronic Component
X5R
Voltage
6.3V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

muRata GRM188R60J476ME15D 产品概述

产品基本信息

muRata(村田)作为全球领先的电子元器件制造商之一,其贴片电容GRM188R60J476ME15D是一款广泛应用于电子电路中的多层陶瓷电容器(MLCC)。此型号电容的容值为47µF,额定电压为6.3V,符合X5R温度系数标准。它具有良好的温度稳定性和电压特性,适合各种通用应用场景。

规格参数

  • 电容值:47µF
  • 容差:±20%
  • 额定电压:6.3V
  • 温度系数:X5R
  • 工作温度范围:-55°C ~ 85°C
  • 安装类型:表面贴装(MLCC)
  • 封装/外壳:0603(1608公制)
  • 尺寸:0.063"(长)x 0.031"(宽)(1.60mm x 0.80mm)
  • 厚度:最大0.039"(1.00mm)

设计和功能

GRM188R60J476ME15D是一款采用0603封装的多层陶瓷电容器,尺寸小巧,适合高密度表面贴装技术(SMT)。其设计使得在有限空间内实现较大电容值成为可能,这对于现代电子设备的小型化设计至关重要。该电容的高电容量使其非常适用于去耦、滤波和储能应用。

X5R温度系数保证了电容在较宽温度范围内能够保持稳定的电容量,满足一般电子设备的温度变化需求。这意味着在使用环境从-55°C到85°C的条件下,电容器的电容值不会出现显著变化,确保电路性能的一致性和可靠性。

应用领域

GRM188R60J476ME15D广泛应用于各种领域和设备中,包括但不限于:

  1. 消费电子:如手机、平板电脑和其他移动设备中用于电源管理和去耦应用。
  2. 工业设备:用于自动化设备、传感器及其他工业控制系统中的信号滤波和电源去耦。
  3. 汽车电子:在汽车控制单元及车载智能设备中应用,保证在振动和宽温度范围内的可靠性。
  4. 通信设备:促进无线通信设备的性能稳定,提高信号完整性。

优势和特性

  • 高稳定性:X5R温度特性提供了优越的电容稳定性,使得该电容器在不同环境下均能维持良好的性能表现。
  • 小型化设计:0603封装适用小型电子设备,为电路设计灵活性提供了支持。
  • 高密度特性:在有限空间内提供较大的电容值,对于高频应用尤其适用。
  • 环保设计:作为陶瓷电容器,使用无铅材料,符合环保法规要求。

安装与使用建议

在使用GRM188R60J476ME15D电容时,应遵循以下建议:

  1. 焊接注意事项:遵循标准的SMT焊接流程,避免过高温度对电容性能的影响。
  2. 布局设计:在电路板设计时,应合理布局电容器的位置,以减少寄生电感和抵抗,确保最佳性能。
  3. 测试与验证:在产品开发阶段,进行充分的测试,验证电容在不同条件下的表现,以保证最终产品的可靠性。

结论

muRata的GRM188R60J476ME15D是一款设计优良的高性能多层陶瓷电容器,凭借其在广泛应用中的出色特性和稳定性,成为现代电子产品不可或缺的一部分。无论是在高密度设计的消费电子产品,还是在对温度和振动敏感的工业和汽车电子领域,这款电容器都能提供卓越的性能,满足各种需求。随着技术的不断进步,GRM188R60J476ME15D将继续在电子元器件行业中发挥重要作用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.