Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
制造商与系列背景
GRM155Z71A105KE01D是由全球知名的电子元器件制造商Murata Electronics(村田制作所)推出的多层陶瓷电容器(MLCC),属于其GRM系列。这一系列电容器广泛应用于各种电子设备中,以其卓越的性能和高可靠性而受到工程师和设计师的青睐。
电气参数与特性
GRM155Z71A105KE01D电容器的主要参数如下:
机械尺寸与安装
该电容器采用0402(1005公制)封装,尺寸为1.00mm x 0.50mm,最大厚度为0.60mm,这种小巧的体积使其适合用于空间受限的电子电路设计中。在表面贴装(SMD)技术日益普及的背景下,GRM155Z71A105KE01D的设计与制造满足了紧凑型电子产品的需求,尤其在手机、平板电脑、电脑主板及其他消费类电子产品中尤其常见。
工作环境与可靠性
此电容器在-55°C到125°C的温度范围内可稳定工作,表明其具备较强的环境适应能力。这种高工作温度范围使得GRM155Z71A105KE01D能够在恶劣环境条件下正常工作,适用于汽车电子设备、工业控制装置及航空航天应用等需要严格温度控制的场景。
应用实例
GRM155Z71A105KE01D电容器的应用范围非常广泛。由于其优秀的电气特性,它们常用于:
结论
GRM155Z71A105KE01D电容器凭借其优异的电性能、紧凑的尺寸和广泛的应用范围,成为了现代电子产品中不可或缺的组件之一。作为Murata Electronics研发的高质量产品,它能够满足各种复杂电子设计的需求,为设计师提供了可靠的解决方案。对设计师而言,选择GRM155Z71A105KE01D电容器意味着能在高性能和空间受限的勤杂应用中达到最佳效果。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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