WMSIC Electronic Components

muRata BLM15HG102SN1D

ModelBLM15HG102SN1D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata BLM15HG102SN1D
Type
MURATA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
BLM15HG102SN1D
Electronic Component
1
Package
0402
Electronic Component
Ferrite Bead
Electronic Component
±25%
Electronic Component
0.015g
Electronic Component
1
Channel Count
1
Electronic Component
BM0000279946
Operating Temperature
55℃~+125℃
Current
250mA
@Frequency
1kΩ@100MHz
Resistor(DCR)
1.1Ω

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:BLM15HG102SN1D

概述 BLM15HG102SN1D 是一款由著名电子元器件制造商村田(muRata)生产的磁珠,采用0402标准《表面贴装型封装》,专为抑制高频噪声和信号线滤波而设计。该产品具有优越的性能,在多种应用场景中能够有效提升电路的稳定性与可靠性,是现代电子设备设计中不可或缺的元件之一。

基本参数

  • 阻抗:在100MHz频率下,BLM15HG102SN1D的阻抗为1kΩ,能够有效抑制高频信号的干扰。
  • 额定电流(最大):该磁珠的额定电流可达到250mA,满足了小型电路中的操作需求。
  • 直流电阻(DCR)(最大):其最大直流电阻为1.1Ω,确保在电流通过时,能量损耗降至最低。
  • 工作温度范围:适应于-55°C至125°C的广泛工作温度,适合于严酷的环境。

设计规格

  • 封装/外壳:0402(1005公制),该封装尺寸小巧,非常适合空间受限的应用。
  • 大小 / 尺寸:其长宽尺寸分别为0.039"(1.00mm)和0.022"(0.55mm),便于在高密度电路板中安装。
  • 高度:最大高度为0.022"(0.55mm),使得该元件在设计上进一步节省空间。

工作原理 BLM15HG102SN1D 磁珠的工作原理主要是通过其电感性,限制信号线中高频噪声的幅度。信号通过磁珠时,高频信号由于自身的高频特性,会产生较大的电流,从而在磁珠的阻抗作用下转化为热能,达到抑制的目的。同时,其低直流电阻特性保证了在信号通过时,系统的能量损失降到最低,保持信号的完整性。

应用场景 BLM15HG102SN1D 磁珠广泛适用于通信设备、消费电子产品、计算机相关设备及汽车电子等领域。在高速数据传输中,例如USB、HDMI接口等,其能够有效抑制EMI(电磁干扰),确保信号的清晰传输。此外,对于电源线滤波、音频设备的干扰抑制、RF(射频)信号处理等场合,BLM15HG102SN1D同样表现出了良好的应用品质。

优势与特点

  1. 高性能:具备良好的高频噪声抑制能力,能够有效过滤不必要的干扰信号。
  2. 小型化设计:0402封装的设计使得其在设计密集电路时无缝集成,满足现代电子设备对空间的严格要求。
  3. 高可靠性:能够在极端的温度和电流条件下稳定工作,确保持久耐用。
  4. 易于集成:表面贴装类型的安装方式,使得其在现代生产线上的自动化贴装变得轻松高效。

总结 作为muRata推出的一款高效磁珠,BLM15HG102SN1D不仅在技术参数上具备先进性,而且设计上也充分考虑到现代电子设备的需求,具备极高的实用性与可靠性。无论是在设计优化还是在性能提升方面,BLM15HG102SN1D都是工程师在电路设计中值得信赖的选择。其应用范围广泛,高性能的特点为各类电子系统带来了更为稳定的信号传输解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.