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muRata GJM1555C1H4R3BB01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- mu Rata GJM1555C1H4R3BB01D
- Type
- MURATA
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GJM1555C1H4R3BB01D
- Electronic Component
- 1
- Electronic Component
- 4.3pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0257273176
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GJM1555C1H4R3BB01D 产品概述
一、主要特性
GJM1555C1H4R3BB01D 是村田（muRata）生产的一款高稳定性多层陶瓷贴片电容（MLCC），标称容值 4.3 pF，额定电压 50 V，温度特性为 C0G（又称 NP0），公差 ±0.1 pF，封装为 0402（约 1.0 × 0.5 mm）。该器件以极低的温度漂移、低损耗、高 Q 值及极小的直流偏压效应为主要卖点，适合高频与高精度电路使用。
二、典型电气性能
- 容值：4.3 pF，±0.1 pF（高精度，适合窄带匹配与滤波设计）
- 额定电压：50 V（适用于射频前端、小信号回路及一般模拟电路）
- 温度系数：C0G/NP0（温度稳定性优良，随温度变化几乎无容量漂移）
- 高频特性：介电损耗低、Q 值高，适合 MHz 至 GHz 频段应用
- 直流偏压效应：极小，容量随偏压变化微弱，便于在匹配网络和振荡电路中稳定使用
三、主要应用场景
- 射频前端：天线匹配网络、滤波器、阻抗调节
- 振荡器与谐振电路：高稳定性时钟与本振电容
- 精密模拟电路：微弱信号耦合、定容网络、补偿电容
- 高频测试与测量：矢量网络分析、校准电容件
- 通信设备与消费电子：滤波与匹配，尤其要求温度稳定性的场合
四、封装与物料信息
- 封装：0402（符合自动贴装工艺，适合空间受限的板级设计）
- 包装形式：一般为卷带（reel）包装，便于高速贴装机使用
- 品牌：muRata（村田），具有成熟制造与品质控制流程
五、选型与布局建议
- 精度要求高的窄带 RF 电路优先选择 C0G/NP0，4.3 pF ±0.1 pF 能显著降低频率漂移与失配误差。
- 版图布线时尽量将高频电容靠近关键器件（如射频放大器、天线端口）以减少走线寄生。
- 使用厂商推荐焊盘尺寸，避免过大或过小焊盘引起的阻抗变化或焊接缺陷。
- 若电路需要更高耐压或更大容量，可考虑更大封装或不同系列产品。
六、焊接与可靠性注意事项
- 遵循村田的回流焊曲线建议进行贴片与回流，采用无铅工艺时注意峰值温度及时间控制（常见无铅回流上限接近业内常规值）。
- 避免在回流或后工序中施加过大的机械应力（弯曲、拉扯），防止陶瓷基片开裂。
- 清洗与保养时避免使用会对陶瓷表面或焊接产生腐蚀的化学剂；生产与维修过程注意防静电与微小零件丢失。
七、替代与扩展建议
- 若对温漂、线性度要求更高可继续使用 C0G 系列；若需更大容量或更高电压可选取同系列更大尺寸或不同型号。
- 在需要成本优化但对温度稳定性要求不那么苛刻的场合，可考虑 X7R 等中高介电常数材料，但需注意温度与电压依赖性。
总结：GJM1555C1H4R3BB01D 以其高稳定性、精密容值与小型封装，适合用于射频匹配、振荡与精密测量等对温度漂移与线性度有严格要求的应用场景。在使用中建议遵循厂商的布局与回流焊建议，以保证长期可靠性与性能稳定。
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