Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM21BR61E106KA73L
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM21BR61E106KA73L
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM21BR61E106KA73L
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0000281318
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM21BR61E106KA73L 产品概述
产品简介
GRM21BR61E106KA73L 是由全球知名电子元器件制造商村田（MuRata）生产的一款多层陶瓷电容器（MLCC），其额定电压为25V，额定电容量为10µF，具备±10%的容差。该电容器采用0805（2012 公制）封装，广泛应用于各种电子设备和电路中。
主要参数
- 电容值: 10µF
- 额定电压: 25V
- 精度: ±10%
- 温度系数: X5R
- 工作温度范围: -55°C 至 85°C
- 容差: ±10%
- 安装类型: 表面贴装
- 封装: 0805（2012 公制）
- 尺寸:
- 长度: 2.00mm
- 宽度: 1.25mm
- 最大厚度: 1.35mm
材料特性
GRM21BR61E106KA73L 使用的电介质材料为 X5R，这是一种常见的温度特性材料，具有良好的温度稳定性和良好的容值变化特性。X5R 电容器在 -55°C 到 85°C 的温度范围内能够保持大约 ±15% 的电容稳定性，这使其在许多高温和低温环境下都能正常工作，适合各种应用需求。
应用领域
GRM21BR61E106KA73L 的应用范围广泛，主要包括但不限于：
- 消费电子: 适用于智能手机、平板电脑、笔记本电脑等消费电子产品中，作为去耦电容和滤波电容。
- 工业设备: 在工业自动化设备及控制系统中，用于平滑电压和减少噪声。
- 汽车电子: 能够承受高温环境的 GRM21BR61E106KA73L 也适合用于汽车电子设备，如导航系统、行车记录仪等。
- 通信设备: 在无线通信产品中，作为 RF 过滤和稳定电源的电容，确保信号的稳定性和完整性。
性能优势
- 小型化: 村田 0805 封装的设计使其体积小，适合在空间受限的电路板上使用。
- 高可靠性: 通过严格的制造工艺和质量控制，确保电容器长期稳定运行，具有良好的耐高温和耐湿性能。
- 优异的电气性能: X5R 材料的选择使得 GRM21BR61E106KA73L 能够在较宽的工作温度范围内保持一致的电容量表现，减少元件老化或性能下降的风险。
结论
GRM21BR61E106KA73L 是一款性能优越，可靠性高的表面贴装多层陶瓷电容器，非常适合在现代电子产品中使用。凭借其10µF的电容量、25V的额定电压和 X5R 的温度特性，这款电容器能够满足多种应用场景的需求，帮助设计师优化电路性能并提高产品的整体可靠性。无论是消费电子、工业应用还是汽车电子领域，GRM21BR61E106KA73L 都是电子设计中不可或缺的关键元件。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
