WMSIC Electronic Components

muRata GRM188R61E475KE11D

ModelGRM188R61E475KE11D
Package0603
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM188R61E475KE11D
Type
MURATA
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM188R61E475KE11D
Electronic Component
1
Electronic Component
4.7uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0126222060
Electronic Component
X5R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GRM188R61E475KE11D 产品概述

1. 概述

GRM188R61E475KE11D 是一款由知名电子元件制造商村田(muRata)生产的多层陶瓷电容器(MLCC)。其容量为4.7µF,额定电压为25V,具有±10%的容差,同时采用X5R温度系数,适合广泛的应用场景,特别是在需要稳定电气性能的环境中。该电容器的封装类型为0603,满足现代电子设备对小型化和高性能的要求。

2. 基本参数

  • 电容值:4.7µF
  • 容差:±10%
  • 额定电压:25V
  • 温度系数:X5R
  • 工作温度范围:-55°C 至 85°C
  • 封装类型:0603(1608公制)
  • 尺寸:1.60mm x 0.80mm x 0.80mm
  • 安装类型:表面贴装

3. 产品特点

  • 高稳定性:采用X5R温度系数,GRM188R61E475KE11D 能够在-55°C到85°C的温度范围内保持良好的电容值稳定性,非常适合在温度变化大的环境中使用。
  • 小型化设计:0603封装使其成为现代电子设备中不可或缺的元件,尤其是在智能手机、平板电脑以及其他便携式电子产品中能够节省空间。
  • 低ESR特性:相比于传统电解电容,陶瓷电容具有较低的等效串联电阻(ESR),可以有效降低功耗,提高电路的工作效率。
  • 可靠性:村田的电容器以其高质量和高可靠性著称,GRM188R61E475KE11D在严苛的工作和环境条件下表现良好。

4. 应用场景

GRM188R61E475KE11D 电容器适用于多种应用,具体包括:

  • 滤波器应用:可用于DC-DC转换器的输出滤波,提升电源的稳定性和降低噪声。
  • 耦合和旁路:适用于高频信号的耦合和旁路,为信号路径提供清晰传输。
  • 去耦电路:可以有效去耦频率高达数百MHz的噪声,改善电路的整体性能。
  • 通讯设备:在无线通讯应用中为射频电路提供所需的电容量,确保信号的稳定。

5. 竞争优势

在广泛的陶瓷电容市场中,GRM188R61E475KE11D 凭借其优异的电气特性和小巧的物理尺寸,具备了显著的竞争优势。其适应性强、可靠性高,并且多层陶瓷结构使得其在生产过程中易于批量化,大幅降低了整体制作成本,是设计师在选择电容器时的重要选择之一。

6. 技术支持和资源

村田为其产品提供全面的技术支持,包括详尽的产品数据手册和应用笔记。这些资源可以帮助设计师有效地进行元器件选择和电路设计,提高产品的性能和可靠性。

7. 结论

总体而言,GRM188R61E475KE11D 是一款功能和性能兼具的高级多层陶瓷电容器,适合用于各种电子设备中。它以其高稳定性、低功耗和简洁的安装方式,成为现代电子设计中一种理想的电容选择。无论在移动设备、消费类电子产品还是工业应用中,这款电容器都能提供卓越的性能支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.