Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
基础信息
GRM1555C1H102GA01D是一款由日本村田(Murata Electronics)制造的多层陶瓷电容器(MLCC),属于GRM系列。这款电容器采用先进的C0G(NP0)温度系数材料,具有出色的温度稳定性和低温漂特性,适合于需要高精度的电子电路设计。它的额定电压为50V,电容值为1000pF(即1nF),标称容差为±2%。这些特性使其成为通用电子应用的重要元器件。
设计与封装特性
GRM1555C1H102GA01D的封装类型为0402(1005公制),尺寸为1.00mm x 0.50mm,最大厚度为0.55mm。这种小型化的设计符合现代电子设备对空间的严格要求,使其在表面贴装技术(SMT)中广泛应用。由于其小巧的封装和轻便的特性,设计工程师可以轻松地将其集成到PCB(印刷电路板)中,帮助实现更紧凑的产品设计。
性能特点
应用领域
由于其优越的性能,GRM1555C1H102GA01D适用于各种电子应用,包括但不限于:
总结
GRM1555C1H102GA01D作为一款高性能的贴片电容(MLCC),凭借其卓越的技术规格和可靠性,使其在当今电子设备中占据了重要的地位。无论是用于消费电子,工业设备,汽车电子,还是通信产品,它都展现出广泛的适用性与强大的性能。凭借其低损耗、高稳定性和小型化设计,GRM1555C1H102GA01D无疑是现代电子工程师在电路设计中不可或缺的重要元器件。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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