Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM0335C1H1R5BA01D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- mu Rata GRM0335C1H1R5BA01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM0335C1H1R5BA01D
- Electronic Component
- 1
- Electronic Component
- 1.5pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0227633657
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM0335C1H1R5BA01D 产品概述
一、产品简介
GRM0335C1H1R5BA01D 为村田（muRata）出品的一款贴片多层陶瓷电容（MLCC），额定电压 50V，容值 1.5 pF，温度系数 C0G（又称 NP0），封装为 0201（约 0.6 mm × 0.3 mm）。该器件以极低的温度漂移和优良的频率特性著称，适用于对稳定性与低损耗有较高要求的射频与高频电路及精密时序电路。
二、主要参数
- 品牌：muRata（村田）
- 型号：GRM0335C1H1R5BA01D
- 容值：1.5 pF
- 额定电压：50 V
- 温度系数：C0G（温度稳定性好、接近零温度系数）
- 封装：0201（小尺寸，节省板面空间）
三、特性与优势
- 温度稳定：C0G/NP0 陶瓷材料在宽温区间内保持几乎不变的电容值，适合要求高精度的电路环境。
- 低损耗、高 Q 值：在高频条件下损耗低，适合射频匹配、滤波和定时回路。
- 电压稳定性好：在 50V 工作下表现稳定，适合小信号与高频场景。
- 超小封装：0201 封装便于在 PCB 上实现高密度布局，适合消费电子与移动终端等空间受限产品。
四、典型应用
- 射频前端匹配网络、带通/带阻滤波器、谐振回路
- 振荡器与时钟电路的负载/定时电容
- 高频耦合、去耦与阻抗调节
- 精密测量仪器和传感器接口中需稳定电容值的场景
五、封装与装配建议
- 0201 为超小尺寸元件，建议使用高精度贴装设备与细距吸嘴。
- 焊接时按厂商推荐的无铅回流曲线进行，避免超出温度与时间规范以免影响可靠性。
- 设计 PCB 焊盘时参考厂商推荐 land pattern，以确保焊点可靠性与热扩散均衡。
- 装配与后处理（如清洗）应避免产生机械应力或化学残留，防止裂纹与性能下降。
六、选型与替代建议
如需更大容量或更高电压可选择同系列不同容值/电压的型号；若应用对电容容差或温漂要求更严格，可咨询厂方数据表以确认容差与稳态参数。对于非射频但需廉价解决方案的场景，可考虑尺寸较大的封装以降低装配难度与成本。
总结：GRM0335C1H1R5BA01D 以其 1.5 pF 的小容值、50V 电压等级、C0G 温度特性及 0201 超小封装，适合高频、精密与空间受限的设计，是射频与精密时序电路中常用的高可靠性元件。若需完整电气与环境规格（如容差、耐温范围、老化特性等），建议查阅村田官方数据手册或直接咨询供应商。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
