Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM188R61E106MA73D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM188R61E106MA73D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM188R61E106MA73D
- Electronic Component
- 1
- Electronic Component
- 10uF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0000285876
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：GRM188R61E106MA73D
一、基本信息
GRM188R61E106MA73D是一款由村田（muRata）公司生产的多层陶瓷电容器（MLCC），具备优异的性能指标和广泛的应用潜力。该电容器的最重要参数如下：
- 电容值: 10μF
- 额定电压: 25V
- 容差: ±20%
- 温度系数: X5R
- 工作温度范围: -55°C ~ 85°C
- 封装类型: 0603（1608公制）
- 尺寸: 1.60mm x 0.80mm x 0.80mm
二、产品特点
高精度与稳定性 GRM188R61E106MA73D以±20%的容差范围确保了在不同应用环境下的稳定表现，尤其适合那些需要较高可靠性的电子电路。
适用的温度范围 该电容器的工作温度范围从-55°C到85°C，确保其在极端环境下依然可以正常工作，因此非常适合汽车电子、工业控制和消费电子等领域。
出色的电气特性 作为X5R介质材料的电容器，GRM188R61E106MA73D能够在一定范围的电压和温度变化中保持较为稳定的电容值，适合用于过滤、耦合和旁路等应用。
紧凑的封装设计 封装尺寸为0603（1.60mm x 0.80mm），这使得GRM188R61E106MA73D能够轻松满足现代电子设备小型化的需求。短小的尺寸不仅有助于节省PCB空间，还能提高电路的整体性能。
表面贴装技术 该电容器采用表面贴装技术（SMD），便于自动化生产和组装，提高了生产效率，并降低了制造成本。
三、应用领域
GRM188R61E106MA73D的广泛适用性使其在多个领域得到应用，包括但不限于：
消费电子 包括智能手机、平板电脑和可穿戴设备等，帮助改善电源管理和信号稳定性。
汽车电子 在汽车控制单元和信号处理电路中广泛使用，包括车载音响系统和自动驾驶传感器。
工业控制 用于各种工业设备中的电源滤波和信号耦合，确保系统在高压和温度波动下可靠运行。
通信设备 在无线电频率（RF）和数据通信设备中，GRM188R61E106MA73D电容器帮助提高信号完整性与传输稳定性。
四、总结
GRM188R61E106MA73D是一款具有出色电气性能和广泛适用性的MLCC电容器。其±20%的容差、10μF的容量以及优异的温度特性，使其成为各类电子产品中的理想选择。由于其小巧的0603封装，更加适合现代对小型、可靠和高效电子设备的需求。选择这款电容器，无疑能够提升电路设计的质量和效率，为各类行业应用提供稳定可靠的电气解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
