Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GCM188R71H224KA64D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GCM188R71H224KA64D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GCM188R71H224KA64D
- Electronic Component
- 1
- Electronic Component
- 220nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0000283379
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GCM188R71H224KA64D 产品概述
一、产品简介
GCM188R71H224KA64D 是一款由日本村田（muRata）公司制造的表面贴装多层陶瓷电容器（MLCC），其设计符合汽车级标准（AEC-Q200），特别适用于高可靠性和高性能的汽车电子应用。这款电容器以其出色的电气性能和稳定的温度特性而著称，广泛应用于汽车电子、电源管理和信号耦合等领域。
二、主要参数
- 精度: ±10%
- 电容值: 220nF（0.22µF）
- 额定电压: 50V
- 温漂系数: X7R，适合多种温度条件下的稳定工作
- 温度范围: -55°C 到 +125°C
- 容差: ±10%
- 封装规格: 0603（1608 mm）
- 规格尺寸: 1.60mm x 0.80mm x 0.90mm（长x宽x厚）
- 安装类型: 表面贴装（SMD）
三、产品特性
GCM188R71H224KA64D电容器基于先进的陶瓷材料技术制造，拥有优异的频率特性和电气性能，在宽电压和温度范围内保持良好的表现。采用X7R介质，确保电容器在温度波动和电压变化的条件下，电容值保持相对稳定，适合于要求严苛的汽车电子和工业应用。
四、应用领域
GCM188R71H224KA64D电容器的主要应用场景包括：
- 汽车电控系统: 作为信号滤波和耦合电路中不可或缺的元件，提供平稳的电源和信号处理能力。
- 电源管理系统: 在DC-DC转换器、稳压电源等电源管理模块中，帮助稳定输出电压，降低纹波。
- 通信设备: 用于信号耦合和滤波，提高信号稳定性和传输质量。
五、性能优势
- 可靠性: 由于符合AEC-Q200汽车质量标准，GCM188R71H224KA64D在极端环境和长期使用条件下表现出色，保证信号传输的可靠性。
- 小型化设计: 0603封装使得电容器在有限的空间内具有良好的嵌入性，适合现代电子设备对体积的要求。
- 热性能: X7R介质的优势在于其在不同温度下保持稳定的电容量，适合于汽车发动机舱、车载电子设备等高温环境。
六、存储与处理注意事项
为确保GCM188R71H224KA64D电容器的性能，推荐遵循以下存储与处理措施：
- 静电防护: 在处理过程中应采取防静电措施，以避免静电对元器件的损害。
- 环境控制: 存储环境需干燥、温度适中，避免在潮湿或极端高温的环境中存放。
- 正确焊接: 对于表面贴装设备的焊接，需控制温度和时间，避免由于过热导致的电容器性能下降。
七、总结
GCM188R71H224KA64D是一款高性能、高可靠性的表面贴装多层陶瓷电容器，具有广泛的应用前景。凭借优越的温度特性、较高的电压应对能力和小巧的封装设计，已经成为汽车电子及其它高要求电子产品的重要配件。对于电子设计工程师来说，选择GCM188R71H224KA64D电容器，可以为其设计提供更多的灵活性与可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
