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muRata GJM1555C1HR20WB01D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- mu Rata GJM1555C1HR20WB01D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GJM1555C1HR20WB01D
- Electronic Component
- 1
- Electronic Component
- 0.2pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0228273939
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GJM1555C1HR20WB01D 产品概述
一、产品简介
GJM1555C1HR20WB01D 为村田（muRata）生产的贴片多层陶瓷电容（MLCC），封装为 0402（常用标称），额定电压 50V，标称电容 0.2 pF，温度特性为 C0G（亦称 NP0）。该系列强调电容随温度变化极小、损耗低、频率响应好，适合对稳定性与低杂散要求高的电路场合。
二、主要特性
- 温度系数 C0G/NP0：电容值随温度变化极微小，适合宽温区稳定工作（典型 C0G 等级在工业温区内接近 0 ppm/°C）。
- 极低电介损耗与高 Q 值：在射频及高频信号路径中表现出低损耗、低等效串联电阻（ESR）和低等效串联电感（ESL）。
- 小容值（0.2 pF）：便于实现极小耦合、微调和匹配网络设计，常用于高频滤波、谐振与阻抗整合。
- 0402 封装：适配高密度 PCB 布局，便于自动化贴装加工。
三、典型应用
- 射频前端匹配、微带线或天线的阻抗匹配与微调件。
- 高频滤波、谐振回路与振荡器负载电容。
- 精密计时与采样电路中作为低漂移分量使用。
- 传感器前端和高阻抗输入回路中补偿或隔离极小容量需求。
四、设计与装配注意事项
- 低容值测量要考虑测试夹具和引线的寄生电容，建议使用短接地路径和低寄生夹具以获得准确数值。
- 0402 封装在回流焊和板载应力下易发生裂纹，布局时应避免过窄的焊盘过渡或在应力集中区域（如板边）直接贴片。
- 对于 RF 应用，布局应尽量缩短走线并保持良好接地，以降低寄生电感对性能的影响。
- 在需要极高稳定性的场合，建议按照厂商推荐的焊盘尺寸和回流曲线进行装配，并参考 Murata 数据手册的可靠性与环境规范。
五、选型与替代建议
若电路需要相同温漂和更高电容量，可考虑同系列更大容值型号；若容值极低但需更高耐压或不同封装，请参考 Murata 全系列 MLCC 数据库或与供应商确认。由于 0.2 pF 属极低容值，采购与测试环节应注意批次一致性与测量方法，必要时索取样品并进行实板验证。
如需最终电气、机械与可靠性参数（如容差、封装尺寸详表、回流规范与寿命测试结果），请以 Murata 官方数据手册为准。
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