WMSIC Electronic Components

muRata LFB152G45CB2D320

ModelLFB152G45CB2D320
PackageSMD-4P,1x0.5mm
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata LFB152G45CB2D320
Type
MURATA
Unit
Electronic Component
Minimum package
10000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
LFB152G45CB2D320
Electronic Component
1
Package
SMD-4P,1x0.5mm
Electronic Component
RFFilter
Electronic Component
34dB;3.5dB;1.5dB;13dB;0.5dB;5dB;2dB;27dB
Electronic Component
0.015g
Electronic Component
50Ω
Electronic Component
1
Frequency
2.45GHz
Electronic Component
BM0228534560
Operating Temperature
40℃~+85℃
Electronic Component
1.7dB
Electronic Component
±50MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LFB152G45CB2D320 产品概述

一、产品简介

LFB152G45CB2D320 为 muRata(村田)推出的小型陶瓷带通滤波器,针对 2.45 GHz ISM 频段优化设计。器件采用 SMD-4P 超小封装(1.0 × 0.5 mm),适合空间受限的无线模块与移动终端,用于抑制带外干扰、改善接收灵敏度并保护前端放大器。

二、主要参数

  • 滤波类型:带通(Band-pass)
  • 中心频率:2.45 GHz
  • 绝对带宽(通带):2.40 GHz ~ 2.50 GHz
  • 系统阻抗:50 Ω
  • 插入损耗:典型 1.7 dB(请参见数据表获取频率依赖曲线)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:SMD-4P,尺寸 1.0 × 0.5 mm
  • 品牌:muRata(村田)

三、关键特性与优势

  • 极小体积:1.0 × 0.5 mm SMD 封装,便于高密度 PCB 布局与模块化设计。
  • 针对 2.45 GHz ISM 频段优化:适配蓝牙、Wi‑Fi(2.4 GHz)、ZigBee 及其他物联网无线协议的前端滤波需求。
  • 低插入损耗:典型 1.7 dB,有利于维持系统链路预算与发射/接收性能。
  • 宽温度范围:满足工业级环境下长期可靠工作要求。

四、典型应用场景

  • 无线通信模块(Bluetooth、Wi‑Fi、ZigBee)
  • IoT 终端与无线传感器节点
  • 无线遥控与智能家居设备
  • 前端射频滤波与带外干扰抑制
  • 射频收发器与功率放大器输入/输出保护

五、PCB 布局与使用建议

  • 尽量将滤波器放置于天线与射频芯片之间的靠近端,减小焊盘到器件的走线长度以降低寄生。
  • 引脚周围应有连续的接地平面并采用过孔贯通(via stitching)以提高隔离与屏蔽效果。
  • 保持输入/输出走线为 50 Ω 微带或带状线,以保证匹配性能。
  • 遵循厂商推荐的焊盘尺寸与回流焊工艺曲线进行组装,避免超过制造商的温度极限。
  • 对于功率较高的应用,参考数据表中功率处理能力与温升信息,必要时进行热管理设计。

六、可靠性与注意事项

  • 器件工作温度覆盖 -40 ℃ ~ +85 ℃,适合工业与消费类应用。
  • 安装与搬运时注意静电放电(ESD)防护,避免在不接地环境下直接接触引脚。
  • 对于关键性能(S21、S11、相群延迟、带外衰减等),应以官方数据表与典型测试曲线为准,并在目标系统中做实际测试验证。

七、结语与资料获取

LFB152G45CB2D320 以其微型封装与针对 2.45 GHz 频段的低插入损耗特性,适合对尺寸、性能有较高要求的无线产品。更多详细电气参数、封装图与推荐焊盘信息,请参阅 muRata 官方数据手册或联系授权代理获取最新资料。

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