WMSIC Electronic Components

muRata GRT155D70J475ME13D

ModelGRT155D70J475ME13D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
mu Rata GRT155D70J475ME13D
Type
MURATA
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRT155D70J475ME13D
Electronic Component
1
Electronic Component
4.7uF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±20%
Electronic Component
0.015g
Electronic Component
1
Electronic Component
BM0259013045
Electronic Component
X7T
Voltage
6.3V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

村田GRT155D70J475ME13D陶瓷电容器产品概述

一、产品基本定位与身份信息

村田GRT155D70J475ME13D是一款多层陶瓷电容器(MLCC),由全球电子元器件龙头厂商muRata(村田)研发生产,属于其通用型小型化封装系列产品。该型号针对电子电路中滤波、耦合、去耦等基础功能设计,适配低电压、高密度PCB布局场景,是消费电子、智能穿戴等领域的常用核心元器件。

二、核心电气性能参数

该产品的电气指标严格遵循村田设计规范,关键参数明确:

  1. 容量与精度:额定容值为4.7μF(电容代码“475”对应:47×10⁵ pF=4.7μF),容量偏差为**±20%**,满足多数通用电路对容量精度的基础需求;
  2. 额定电压:直流额定电压为6.3V,可稳定承受该电压下的连续工作,同时具备符合村田安全标准的过压裕量;
  3. 直流偏置特性:作为X7T介质电容,容量随直流偏置电压的变化相对平缓,在6.3V额定电压下,容量衰减通常控制在10%以内(具体数据参考村田官方 datasheet);
  4. 电容代码解析:型号中“475”为容值编码,“J”关联精度属性,需以实际应用参数(±20%)为准。

三、封装与物理特性

  1. 封装规格:采用0402英寸封装(公制对应1005,即1.016mm×0.508mm),属于小型化贴片封装,适配高密度PCB设计;
  2. 尺寸细节:典型长度1.0±0.05mm,宽度0.5±0.05mm,厚度约0.5mm(具体尺寸以村田官方发布为准),满足小型电子设备的空间限制;
  3. 结构与电极:采用多层陶瓷介质堆叠结构,电极材料为镍基合金,端电极设计适配回流焊工艺,焊接附着力强,可承受多次焊接循环;
  4. 材料特性:介质材料为X7T对应陶瓷,具有良好的介电常数稳定性和温度适应性。

四、温度特性与可靠性

  1. X7T温度系数解析:
    • 工作温度范围:-55℃至+125℃;
    • 25℃基准下,容量变化率≤±15%;
      该特性使产品可适应户外低温、设备内部高温等复杂环境;
  2. 可靠性测试:符合JIS C 5102、IEC 60384-1等国际标准,经过以下核心测试:
    • 耐湿度测试(85℃/85%RH环境下长期工作);
    • 温度循环测试(-55℃至+125℃循环);
    • 机械应力测试(振动、冲击);
      产品失效率远低于行业平均水平,适合批量稳定生产。

五、典型应用场景

因小型化、低电压、常规容值的特点,该产品广泛应用于:

  1. 消费电子:智能手机、平板电脑的电源滤波、音频耦合电路;
  2. 智能穿戴:智能手表、蓝牙耳机的低功耗MCU周边、传感器滤波;
  3. 小型工业设备:工业传感器模块、低电压控制电路;
  4. 通信设备:小型路由器、无线模块的射频前端滤波、去耦;
  5. 家用电子:智能音箱、遥控器的电源电路、信号耦合。

六、产品优势与适配性

  1. 小型化集成:0402封装大幅节省PCB空间,适配电子设备轻薄化趋势;
  2. 宽温稳定:X7T温度特性覆盖-55℃至+125℃,容量变化小,环境适应性强;
  3. 品牌可靠性:村田产品一致性好,批量采购质量稳定,降低生产不良率;
  4. 工艺兼容性:适配回流焊、波峰焊等主流工艺,适合自动化生产线;
  5. 通用适配:4.7μF容值、6.3V电压覆盖大量通用电路,替换和采购方便。

该产品是村田通用型MLCC的典型代表,凭借稳定的性能、小型化设计和可靠的质量,成为电子设备中基础电路的优选元器件。

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