WMSIC Electronic Components

muRata GRM32DR71E106KA12L

ModelGRM32DR71E106KA12L
Package1210
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM32DR71E106KA12L
Type
MURATA
Unit
Electronic Component
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM32DR71E106KA12L
Electronic Component
1
Electronic Component
10uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.163g
Electronic Component
1
Electronic Component
BM0000002299
Electronic Component
X7R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GRM32DR71E106KA12L

一、产品简介

GRM32DR71E106KA12L 是一款高性能的多层陶瓷电容器(MLCC),由著名电子元器件制造商村田(muRata)生产。该电容具有10µF的电容量,额定电压为25V,容差为±10%。其温度系数为X7R,这使其在广泛的温度范围内(-55°C至125°C)依然保持稳定的电气性能。它采用表面贴装(SMD)技术,封装尺寸为1210(3225 公制),适合现代电子产品的紧凑设计需求。

二、技术规格

  • 电容值:10µF
  • 容差:±10%
  • 额定电压:25V
  • 温度系数:X7R
  • 工作温度范围:-55°C ~ 125°C
  • 安装类型:表面贴装 (SMD)
  • 封装/外壳:1210 (3225 公制)
  • 尺寸:长3.20mm x 宽2.50mm,厚度最大为2.20mm

三、性能优势

  1. 高稳定性:由于采用了X7R的陶瓷材料,该电容在不同温度和电压条件下能够保持良好的电容值,适应各种工作环境,确保电路的稳定性。

  2. 紧凑设计:1210封装使得GRM32DR71E106KA12L在电路板上占用的空间非常小,适合用于空间受限的应用场景,如移动设备、传感器等。

  3. 广泛适用性:其工作温度范围涵盖了工业标准,可以广泛应用于消费电子、电源管理、高频通讯及汽车电子等众多领域。对于要求高可靠性和耐环境能力的产品,该电容具有较强的优势。

  4. 高ESR特性:与其他电容量相同的电容器相比,陶瓷电容往往具有更低的等效串联电阻(ESR),使其在高频转换和滤波应用中表现出色。

四、应用领域

GRM32DR71E106KA12L 适用于多个电子领域,包括但不限于:

  • 消费电子:手机、平板电脑、智能电视等家电类产品。
  • 汽车电子:汽车音响、导航系统、电动机驱动控制等车载应用。
  • 工业设备:传感器、控制系统、PLC(可编程逻辑控制器)等。
  • 电源管理:DC-DC转换器、滤波电路等电源适配器中,为系统提供稳定的电压。

五、总结

GRM32DR71E106KA12L 作为一款优秀的多层陶瓷电容,其品质和性能在同行业中处于领先地位。无论是在高效能的消费类电子产品,还是在要求极高可靠性的工业或汽车应用中,它都能够为设计工程师提供可靠的选择。村田作为行业先锋,其在材料科学和制造工艺方面的深厚背景确保了这一产品的高质量标准和长期的市场稳定性,使其在众多电容器中脱颖而出。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.