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muRata GRM033R61A224KE90D
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM033R61A224KE90D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM033R61A224KE90D
- Electronic Component
- 1
- Electronic Component
- 220nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0257268124
- Electronic Component
- X5R
- Voltage
- 10V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GRM033R61A224KE90D 产品概述
一、产品简介
GRM033R61A224KE90D 为村田（muRata）生产的贴片多层陶瓷电容（MLCC），标称容值 220 nF，容差 ±10%，额定电压 10 V，温度特性为 X5R，封装尺寸为 0201（公制约 0.6 × 0.3 mm）。该产品以体积小、可靠性高著称，适用于要求极小封装和旁路、耦合或去耦功能的移动设备与高密度电路板。
二、主要特性
- 小尺寸：0201 封装，适合高密度 PCB 布局和空间受限的终端产品。
- 容量与精度：220 nF / ±10%，适合对容值有中等精度要求的场合。
- 额定电压：10 V，适用于低压电源、模拟与射频前端电路等。
- X5R 温度特性：在 −55°C 至 +85°C 范围内电容变化在允许范围内，适合一般工业与民用温度环境。
- 村田品质：材料与制造工艺成熟，批次一致性与可靠性有保证。
三、应用场景
- 电源去耦与旁路（尤其是移动终端、蓝牙/无线模块、射频前端的局部去耦）。
- 模拟滤波与耦合（在空间受限的模拟电路中替代更大封装的电容）。
- 移动设备、可穿戴设备、消费电子和高密度主板等对体积敏感的应用。
四、设计与布板建议
- DC 偏置与电容衰减：X5R 等高介电常数陶瓷在直流偏置下会出现容量下降，接近额定电压使用时容量可能显著降低。建议在选型时参考厂商 DC-bias 曲线，必要时留足裕量。
- 串联电感与 ESR：0201 封装本身 ESL/ESR 较小，适合高速去耦；但并联多只电容以覆盖不同频段的去耦效果更佳。
- 焊接与热循环：遵循村田推荐的回流焊工艺与温度曲线，避免在回流过程中受到过度机械应力或多次高温循环造成的裂纹风险。贴装时注意不要施加过大剪切力。
五、可靠性与检验要点
- 机械应力敏感：超小封装对PCB翘曲、机械冲击更敏感，设计时注意减少板翘并采用适当的焊盘/过孔设计。
- 温度与寿命：X5R 适用于常规工业与商业温度范围，极端高温或持续偏压下需按应用评估寿命与漂移。
- 质量追溯：选择正规渠道采购以保证原厂出货与批次可追溯，便于可靠性验证与长期供货支持。
六、选型与替代考虑
- 若对 DC-bias 性能有较高要求，可考虑电容额定电压提高或选用介质温度/偏压特性更稳定的材料（如 NP0/C0G 或低介电常数方案，但体积会增大）。
- 需要相同封装与性能的替代产品时，可寻找其他厂商相同尺寸（0201）、220 nF、10 V、X5R、±10% 的 MLCC，注意对比 DC-bias 曲线与封装厚度等参数以确保兼容。
如需更详细的电气参数（如 ESR、ESL、温度/偏压曲线、焊接规范或包装信息），建议参照村田官方产品数据手册或提供具体应用场景以便给出更精确的选型建议。
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