WMSIC Electronic Components

muRata GRM188R71C104KA01D

ModelGRM188R71C104KA01D
Package0603
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM188R71C104KA01D
Type
MURATA
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM188R71C104KA01D
Electronic Component
1
Electronic Component
100nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0084326510
Electronic Component
X7R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GRM188R71C104KA01D - 村田贴片电容

一、产品介绍

GRM188R71C104KA01D是一款高性能的多层陶瓷电容器(MLCC),由知名电子元器件制造商村田(muRata)推出。作为0603封装的表面贴装电容(SMD),它具备尺寸小、稳定性高和应用广泛等诸多优势,特别适合在现代电子产品中使用。该电容的额定电压为16V,电容值为0.1µF(100nF),其容差为±10%,适用于多种应用场景。

二、技术参数

  • 电容(Capacitance): 0.1µF
  • 容差(Tolerance): ±10%
  • 额定电压(Rated Voltage): 16V
  • 温度系数(Temperature Coefficient): X7R
  • 工作温度(Operating Temperature): -55°C ~ 125°C
  • 安装类型(Mounting Type): 表面贴装(SMD)
  • 封装/外壳(Package/Case): 0603(1608 公制)
  • 尺寸(Size): 0.063" 长 x 0.031" 宽(1.60mm x 0.80mm)
  • 厚度(Height): 0.035"(0.90mm)

三、产品特点

  1. 高稳定性与可靠性: GRM188R71C104KA01D采用X7R温度系数,这种材料确保了电容在广泛的温度范围内都能够维持相对稳定的电容值,尤其在温度变化剧烈的环境中表现出色。该元件的工作温度范围为-55°C到125°C,能够满足多种苛刻环境下的应用需求。

  2. 优越的尺寸和轻便性: 0603(1.6mm x 0.8mm)的封装尺寸使得该电容非常适合现代微型电子设备和紧凑型电路设计。较小的体积可以让设计师在确保电路性能的同时,节省宝贵的电路板空间。

  3. 广泛的适用性: 该产品的额定电压为16V,适合于多种电压水平的电子设备,尤其在消费电子、工业控制、汽车电子等领域,GRM188R71C104KA01D都能找到其身影。此外,它在某些高频应用中也展现出良好的表现。

  4. 简单的表面贴装(SMT)设计: 作为表面贴装电容,GRM188R71C104KA01D的安装方式与现代电子制造技术完美契合,使得生产效率大大提高,同时减少了焊接过程中的不良品率。

四、应用场景

GRM188R71C104KA01D的通用性使其可广泛应用于多种电子产品中。以下是一些常见的应用场景:

  • 消费电子: 包括智能手机、平板电脑、笔记本电脑等,这些产品在其高频电路中对电容器的稳定性和可靠性有较高的要求。
  • 汽车电子: 在汽车中的电子控制单元(ECU)、传感器和信号处理器等模块中,可以使用这种电容以保证其在高温和震动环境下的稳定工作。
  • 工业设备: 在工业自动化设备和控制系统中,GRM188R71C104KA01D被用作滤波和耦合电容,以提高电路的整体性能和抗干扰能力。
  • 通信设备: 在RF和微波通信设备中,作为匹配和耦合元件,提升信号传输性能。

五、总结

GRM188R71C104KA01D是一款符合现代电子产品需求的小型高性能电容器。其卓越的技术参数、广泛的应用范围和稳定的性能,使其成为设计师在开发和制造各类电子设备时,首选的重要元器件之一。无论是在快速消费品、工业设备还是汽车应用中,这款电容器始终能够提供可靠的性能表现,助力电子产品的成功开发与应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.