WMSIC Electronic Components

muRata LQW15CN1R0M10D

ModelLQW15CN1R0M10D
Package0402
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
mu Rata LQW15CN1R0M10D
Type
MURATA
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
LQW15CN1R0M10D
Electronic Component
1
Package
0402
Type
Display Inductor
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.015g
Inductor
1uH
Electronic Component
1
Electronic Component
BM0257559900
Current
270mA
Resistor(DCR)
940mΩ
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LQW15CN1R0M10D 产品概述

一、产品简介

LQW15CN1R0M10D 为村田(muRata)出品的小型功率电感,标称电感量 1.0 μH,公差 ±20%,额定电流 270 mA,直流电阻(DCR)约 940 mΩ,封装为 0402(1.0 × 0.5 mm)无屏蔽表面贴装型。该器件以体积小、便于贴装及适用于高密度 PCB 布局为特点,主要面向低功率电源滤波、去耦与 EMI 抑制等应用场景。

二、主要特性

  • 电感值:1.0 μH,适合需要中等阻抗的滤波与振荡回路。
  • 精度:±20%,适用于对电感容忍范围较宽的电源与信号滤波场合。
  • 额定电流:270 mA,适合微功率到中等功率的 DC-DC 降压/升压前后端滤波使用,但不适合大电流输出端。
  • DCR:约 940 mΩ,较高的直流电阻意味着在直流通过时会有较明显的压降与功耗,需要在设计时评估热耗与效率影响。
  • 无屏蔽结构:体积更小,但磁场泄漏相对更大,近距离布线时需注意对其它元件的耦合影响。

三、典型应用场景

  • 手机、可穿戴与小型消费电子的电源去耦与输入滤波。
  • 低功率 DC-DC 转换器(作为输入/输出滤波元件)。
  • 模拟前端或射频模块中的低频滤波与阻抗匹配(在允许精度范围内)。
  • PCB 空间受限的便携式设备与传感器节点,需在保证热与效率的前提下使用。

四、设计与使用建议

  • 电流与温升:由于 DCR 较高,使用时需计算通过电感的最大直流分量所产生的压降与功耗(P = I^2·DCR),并对器件及周边进行热评估,避免长时间过载导致温度上升。
  • 直流磁化效应:电感在直流偏置下会出现电感量下降,应在实际工作电流条件下测量或参考厂商在典型条件下的电感-电流曲线进行余量设计。
  • 无屏蔽影响:若在敏感电路或高密度布局中使用,应注意布局间距与地线设计,必要时采用屏蔽或改用屏蔽型电感以降低磁耦合。
  • 焊接与回流工艺:遵循厂商推荐的回流曲线,避免过高的回流温度或过长的加热时间,防止焊接应力导致电感性能变动或机械损伤。
  • 测试与验收:推荐使用 LCR 表在目标频率(例如 100 kHz 或工作频段)下测量实际电感值,并用毫欧表测量 DCR,确认批次一致性。

五、封装与可靠性

0402 封装优势在于占板面积小、适合自动化贴装,但相对机械强度与热容量较低。器件在反复热循环、机械冲击与高湿环境下的可靠性依赖于封装质量与焊接工艺。对于关键设备,建议做温度循环与湿热测试验证实际寿命。

六、选型和替换建议

当系统对功率损耗和压降敏感时,优先考虑 DCR 更低、额定电流更高的同系列或替代型号;当电磁兼容(EMC)或磁场耦合是关键问题时,优先选用屏蔽型电感或增加磁屏蔽措施。若需更精准的电感值或较小的电感变化,应选择更高精度(例如 ±10% 或 ±5%)的型号。

总结:LQW15CN1R0M10D 以其超小封装与中等电感值适合空间受限、功率较低的滤波与去耦应用,但需注意其较高的 DCR 与无屏蔽特性,在设计时应对电流承载、热管理与电磁耦合进行评估,确保可靠性与性能满足系统需求。

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