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muRata BLM03PX330SN1D
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata BLM03PX330SN1D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- BLM03PX330SN1D
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0001581550
- Current
- 1.5A
- @Frequency
- 33Ω@100MHz
- Resistor(DCR)
- 55mΩ
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BLM03PX330SN1D 产品概述
一、产品简介
BLM03PX330SN1D 是村田（muRata）推出的一款微型磁珠，0201 封装、单通道设计，主要用于高频干扰抑制与电源/信号线的电磁兼容（EMC）优化。器件在 100MHz 时的阻抗为 33Ω，直流电阻（DCR）典型值为 55mΩ，额定持续电流 1.5A，阻抗误差规格 ±25%，适合对空间与性能都有严格要求的便携式与消费电子设备。
二、主要参数一览
- 封装：0201（约 0.6 × 0.3 mm）单通道
- 阻抗：33Ω @ 100MHz
- 直流电阻（DCR）：约 55 mΩ（典型）
- 额定电流：1.5 A（持续）
- 阻抗误差：±25%
- 品牌：muRata（村田）
三、电气与性能特点
该磁珠在高频区（以 100MHz 为基准）表现出显著的阻抗，用于吸收并衰减高频噪声。低 DCR 保证了在直流及低频工作时的压降和功耗都较小，利于保持电源效率。±25% 的误差范围为典型磁珠公差，可满足一般 EMI 抑制设计要求。1.5A 的额定电流使其可用于中低功率电源轨与高速信号线。
四、典型应用场景
- 手机、平板与可穿戴设备的电源噪声抑制
- 模组与 PCB 上的电源/地线滤波（VCC、DVDD 等）
- 无线通信设备与射频前端的 EMI 降噪配合
- 工业与消费类电子的小型化滤波方案
五、选型与布局建议
- 将磁珠尽量靠近噪声源（如电源开关器件或射频发射器）或靠近被保护的电路端布置，以获得最佳抑制效果。
- 对于电源线，优选在电路入口或去耦电容与负载之间串联使用，配合旁路电容形成滤波网络。
- 由于封装为 0201，焊接工艺要求严格，推荐按照村田推荐的回流曲线与焊盘设计进行贴装，保证可靠性。
- 注意额定电流限制，若工作电流接近或超过 1.5A，应选用更大封装或更高额定电流的型号。
六、可靠性与注意事项
- 频繁的大电流冲击或过高温度会改变磁珠特性，可能导致阻抗下降或直流电阻变化，设计时需留有裕量。
- 封装极小，机械应力（如过度刮擦、弯曲）容易导致性能退化或失效，建议在 PCB 设计与后加工中采取防护措施。
- 在高频抑制需求较强的场合，可结合不同频段阻抗特性的磁珠或 LC 网络以覆盖更宽频段的噪声抑制。
七、结论
BLM03PX330SN1D 以其 0201 的微小封装、在 100MHz 附近 33Ω 的有效阻抗和较低的 DCR（55mΩ）适用于空间受限且需对高频噪声进行抑制的应用场合。设计时应注意额定电流 1.5A 与封装工艺要求，在合理布局与配合旁路元件的前提下，能够为便携与消费类电子提供可靠的 EMI 抑制效果。若需更详细的温升、频率特性曲线与焊接工艺参数，建议参考村田官方数据手册。
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