Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
muRata GRM155R61E225KE11D
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- mu Rata GRM155R61E225KE11D
- Type
- MURATA
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- MURATA
- Electronic Component
- GRM155R61E225KE11D
- Electronic Component
- 1
- Electronic Component
- 2.2uF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.015g
- Electronic Component
- 1
- Electronic Component
- BM0000603887
- Electronic Component
- X5R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：GRM155R61E225KE11D
GRM155R61E225KE11D是一款由日本著名电子元器件制造商村田（muRata）生产的多层陶瓷电容器（MLCC），广泛应用于各种电子设备中。这款电容器以其性能稳定、体积小巧、及广泛的工作温度范围而受到业界的重视，成为许多现代电子设计的首选。
基本参数
电容值：该电容器的标称电容值为2.2µF，能够有效提供所需的电容性能，适用于滤波、旁路、耦合等多种应用场景。
容差：其容差为±10%，保证了在特定应用中较为精准的电容值，可以适应多种工作环境的需求，提高了电路的稳定性。
额定电压：该电容器的额定电压为25V，适合在较大电压条件下使用，能够满足多数低压电子电路的需求，保障安全和可靠性。
温度系数：采用了X5R温度系数，具有较好的温度稳定性。X5R特性意味着在-55°C 到 85°C的宽温度范围内，电容值变化在±15%以内，适合高温、低温下的应用。
工作温度范围：其工作温度范围从-55°C 到 85°C，适用于许多严苛环境下的电子设备，比如汽车电子、工业设备等。
封装与尺寸
GRM155R61E225KE11D的封装类型为0402（1005公制），这是一种非常小型的表面贴装封装，尺寸为0.039" x 0.020"（1.00mm x 0.50mm），厚度最大为0.022"（0.55mm）。这种小巧的设计使得该电容器非常适用于空间受限的应用，如便携式设备、智能手机、平板电脑等。
应用领域
GRM155R61E225KE11D因其优良的性能被广泛应用于多个领域，如电子消费品、工业设备、汽车电子、通讯设备和医疗设备等。其高可靠性使其在恶劣工作环境中仍然能够保持稳定的性能，符合现代电子产品对于高密度、高集成度的需求。
其他特性
村田（muRata）是全球领先的应用无源电子元器件的制造商之一，以其卓越的产品质量和创新能力闻名。在生产GRM155R61E225KE11D时，村田采用了先进的制造工艺和严格的质量控制，确保每一颗电容器都是高性能、可靠的选择。
在选择适合的电容器时，GRM155R61E225KE11D的多样性和适用性，可以为电子设计师提供一个非常好的方案，不论是用于电源管理、信号耦合、还是滤波应用。
总结
GRM155R61E225KE11D电容器凭借其2.2µF的电容值、25V的额定电压、X5R温度系数以及宽广的工作温度范围，满足了当今电子产品对高性能的需求。其0402封装的设计使之在空间受限的设计中仍然能够提供可靠的性能，是现代电子设备中不可或缺的重要元器件之一。无论在设计中遇到何种挑战，该电容器都能提供优质的解决方案，帮助电子工程师实现创新与完美。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
