WMSIC Electronic Components

muRata GRM033R61A225KE47D

ModelGRM033R61A225KE47D
Package0201
BrandmuRata
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
mu Rata GRM033R61A225KE47D
Type
MURATA
Unit
Electronic Component
Minimum package
15000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
MURATA
Electronic Component
GRM033R61A225KE47D
Electronic Component
1
Electronic Component
2.2uF
Package
0201
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.008g
Electronic Component
1
Electronic Component
BM69415455
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
15000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:GRM033R61A225KE47D

一、基本信息

GRM033R61A225KE47D是由日本著名电子元器件制造商村田(muRata)生产的一款高性能多层陶瓷电容器(MLCC)。它的电容值为2.2µF,具有10V的额定电压和±10%的容差,采用X5R的温度系数,适用范围广泛。这款电容器被设计为表面贴装(SMD)类型,封装尺寸为0201(即0603公制),适用于现代电子产品中对空间要求较高的领域。

二、性能特点

  1. 电容类型:此电容器为多层陶瓷电容器(MLCC),其特点是高容量、低ESR(等效串联电阻)和广泛的工作温度范围。MLCC具有良好的频率特性,适合高频信号的应用。

  2. 电压和容差:GRM033R61A225KE47D的额定电压为10V,适用于工作电压较低的电路。这一参数的设计确保了电容器在额定电压下能够稳定工作,并能够承受一定的过压情况。对于容差为±10%的设计,意味着实际电容值在2.0µF到2.4µF之间,适合各种需要一定容忍度的应用。

  3. 温度系数:X5R为一种常见的温度系数类型,适合于-55°C至85°C的工作环境,适合大多数工业和消费电子产品。该电容器在这个温度范围内具备较好的稳定性和可靠性,适合于气候变化或温度波动较大的应用环境。

  4. 表面贴装:作为表面贴装元器件,可直接焊接在电路板表面,节省了空间并降低了整体电路板的厚度。这非常符合当前电子产品越来越小型化、集成化的趋势。

  5. 封装尺寸:0201封装尺寸(0.024" x 0.012",即0.60mm x 0.30mm)使得该电容器在小型设备中极具优势,能够满足高密度布线的需求。

三、应用场景

由于其优良的电气性能和紧凑的尺寸,GRM033R61A225KE47D广泛应用于多种电子设备,主要包括:

  • 移动设备:智能手机、平板电脑、便携式媒体播放器等对空间及效能要求极高的移动设备中,提供滤波、旁路等功能。
  • 消费电子:电视、音响、游戏机等产品中也可见到此款电容器,承担信号耦合、去耦和电源滤波的角色。
  • 工业设备:用于传感器、控制器和驱动电路等工业级应用,表现出色的温度特性使其能在严酷环境中稳定运行。
  • 汽车电子:在现代汽车中,电子控制单元(ECU)和各种传感器对电容器的需求日益增长,GRM033R61A225KE47D因为其可靠性和耐环境能力,成为理想选择。

四、总结

GRM033R61A225KE47D是村田公司生产的一款高性能表面贴装多层陶瓷电容器,具备2.2µF电容、10V额定电压、±10%容差及广泛的工作温度范围,适用于多种应用场景。它的0201封装使其具备较小的体积,同时又不影响其性能,大大满足了现代电子产品对体积和性能的双重需求。无论是在消费电子、移动设备还是工业应用中,GRM033R61A225KE47D都展现出其卓越的性能和无与伦比的可靠性,为用户提供了理想的解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.